Simultaneous Double-Side Grinding Of Semiconductor Wafers
First Claim
1. A method for the correction of the grinding spindle positions in a double-side grinding machine for the simultaneous double-side machining of semiconductor wafers, comprising torsionally coupling two grinding spindles of the grinding machine, each spindle comprising a grinding disk flange for receiving a grinding disk, by a torsional coupling element, and supplying a measuring unit comprising an inclinometer and at least two sensors for distance measurement, the measuring unit mounted instead of grinding disks between the two grinding disk flanges such that the grinding spindles are in the same position they occupy with mounted grinding disks during the grinding process, rotating the coupled grinding spindles during grinding of a substrate, determining radial and axial correction values of an axial alignment of the two grinding spindles by means of the inclinometer and sensors, and correcting the orientation of the grinding spindles from these values to obtain a symmetrical orientation of the two grinding spindles.
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Accused Products
Abstract
Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
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Citations
14 Claims
- 1. A method for the correction of the grinding spindle positions in a double-side grinding machine for the simultaneous double-side machining of semiconductor wafers, comprising torsionally coupling two grinding spindles of the grinding machine, each spindle comprising a grinding disk flange for receiving a grinding disk, by a torsional coupling element, and supplying a measuring unit comprising an inclinometer and at least two sensors for distance measurement, the measuring unit mounted instead of grinding disks between the two grinding disk flanges such that the grinding spindles are in the same position they occupy with mounted grinding disks during the grinding process, rotating the coupled grinding spindles during grinding of a substrate, determining radial and axial correction values of an axial alignment of the two grinding spindles by means of the inclinometer and sensors, and correcting the orientation of the grinding spindles from these values to obtain a symmetrical orientation of the two grinding spindles.
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14. A device comprising a hydrostatic bearing for axially guiding a semiconductor wafer in a double-side grinding machine, said bearing comprising a cutout through which a grinding disk interacts with a semiconductor wafer, wherein two sensors for distance measurement are mounted on the hydrostatic bearing, the sensors spaced apart by an angle of at least 30°
- and at most 150°
with respect to a circumference of the grinding disk.
- and at most 150°
Specification