Simultaneous Double-Side Grinding Of Semiconductor Wafers

• US 20090104846A1
• Filed: 10/01/2008
• Published: 04/23/2009
• Est. Priority Date: 10/17/2007
• Status: Active Grant

• Current Assignee: Siltronic AG (Dr. Alexander Wacker Familiengesellschaft Mit Beschrã¤Nkter Haftung)
• Original Assignee: Siltronic AG (Dr. Alexander Wacker Familiengesellschaft Mit Beschrã¤Nkter Haftung)
• Inventors: Weiss, Robert, Junge, Joachim
• Granted Patent: US 8,197,300 B2
• Time in Patent Office: Days
• US Class Current: 451/5
• CPC Class Codes: B24B 37/08 for double side lapping
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence

Abstract

Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.

Claims

1. A method for the correction of the grinding spindle positions in a double-side grinding machine for the simultaneous double-side machining of semiconductor wafers, comprising torsionally coupling two grinding spindles of the grinding machine, each spindle comprising a grinding disk flange for receiving a grinding disk, by a torsional coupling element, and supplying a measuring unit comprising an inclinometer and at least two sensors for distance measurement, the measuring unit mounted instead of grinding disks between the two grinding disk flanges such that the grinding spindles are in the same position they occupy with mounted grinding disks during the grinding process, rotating the coupled grinding spindles during grinding of a substrate, determining radial and axial correction values of an axial alignment of the two grinding spindles by means of the inclinometer and sensors, and correcting the orientation of the grinding spindles from these values to obtain a symmetrical orientation of the two grinding spindles.

2. The method of claim 1, wherein the inclinometer measures an angle of rotation, a first sensor measures a radial distance from an opposite grinding disk flange and a second sensor measures an axial distance on a diameter described by this sensor during rotation of the grinding spindles, wherein a receptacle plate fixed on the grinding disk flange serves as a measuring bell for the radial and axial distance measurements.

3. The method of claim 2, wherein horizontal and vertical correction values of the axial alignment of the two grinding spindles are determined from angle of rotation and radial and axial distances with respect to machine-typical lever travels.

4. The method of claim 1, wherein the sensors are optical or inductive distance sensors.

5. The method of claim 1, wherein at least one sensor is an eddy current sensor having a resolution of 0.4 μ

m-2 μ

m.

6. The method of claim 1, wherein a control unit conditions angle of rotation and distance data and calculates horizontal and vertical corrections for spindle adjustment.

7. The method of claim 1, wherein the torsionally coupled grinding spindles are rotated through 360°

during a measurement cycle of the inclinometer, sensors, or both inclinometer and sensors.

8. A method for the simultaneous double-side grinding of a semiconductor wafer employing the correction method of claim 1, comprising machining a semiconductor wafer in material-removing fashion between two rotating grinding disks affixed on opposite collinear spindles, wherein the semiconductor wafer, during machining, is guided axially by means of two hydrostatic bearings in a manner substantially free of constraint forces, is guided radially by means of a guide ring, and is caused to rotate by a driver, wherein during the grinding of a semiconductor wafer, radial distances between at least one hydrostatic bearing and a grinding wheel are measured by means of at least two sensors, and horizontal and vertical correction values of a position of a spindle are calculated therefrom, and the spindle position is correspondingly corrected.

9. The method of claim 8, wherein two sensors are fixed to a hydrostatic bearing, the sensors spaced apart by an angle of at least 30°

and at most 150°

with respect to a circumference of an associated grinding disk.

10. The method of claim 8, wherein two sensors are fixed to each of the two hydrostatic bearings, the sensors on each bearing spaced apart by an angle of at least 30°

and at most 150°

with respect to a circumference of the associated grinding disk.

11. The method of claim 8, wherein the sensors are eddy current sensors.

12. A device for carrying out the method of claim 1, comprising two opposite, collinear rotatable grinding spindles each comprising a grinding disk flange suitable for receiving a grinding disk, wherein the grinding disk flanges are torsionally coupled, and between the two torsionally coupled grinding disk flanges, at least one measuring unit comprising an inclinometer and at least two sensors for distance measurement is mounted on one of the two grinding disk flanges, wherein the grinding spindles are in a position in which they would be situated with mounted grinding disks during a grinding process, and wherein a first sensor is suitable for measuring a radial distance from a grinding disk flange opposite the sensor and a second sensor is suitable for measuring an axial distance from a measuring bell mounted on the grinding disk flange.

13. The device of claim 12, wherein the measuring bell is a receptacle plate which comprises horizontal and vertical strips in the direction of the spindle axis and is mounted on a grinding disk flange, wherein one sensor is directed at the horizontal strip (radial distance sensor) and the second sensor is directed at the vertical strip (axial distance sensor).

14. A device comprising a hydrostatic bearing for axially guiding a semiconductor wafer in a double-side grinding machine, said bearing comprising a cutout through which a grinding disk interacts with a semiconductor wafer, wherein two sensors for distance measurement are mounted on the hydrostatic bearing, the sensors spaced apart by an angle of at least 30°

and at most 150°

with respect to a circumference of the grinding disk.