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Polyester moulding composition for use in electronic devices

  • US 20090105381A1
  • Filed: 04/21/2006
  • Published: 04/23/2009
  • Est. Priority Date: 05/03/2005
  • Status: Abandoned Application
First Claim
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1. A polyester molding composition having a comparative tracking index (CTI) of at least 400 Volt and a glow wire ignition temperature (GWIT) of at least 775°

  • C. at 1.0 mm, consisting of(A) 100 parts by weight (pbw) of a polymer composition consisting of (A-i) at least 50 pbw of a thermoplastic polyester, and, optionally, (A-ii) at least one other polymer,(B) between 2 and 40 pbw of a flame retardant system consisting of (B-i) a nitrogen based organic flame retardant compound free of phosphorus or a phosphorus free salt thereof, and, optionally,(B-ii) less than 1 pbw of a phosphorus containing flame retardant compound, comprising less than 0.1 pbw of an arylenedioxy-tetrakisphenyl-diphosphate and substituted and oligomeric derivatives thereof, (C) between 0.01 and 1 pbw of a mould release agent, and optionally(D) 0-10 pbw of a fibrous reinforcing agent, and(E) 0-100 pbw of other additives.

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