In vivo imaging device and method of manufacturing thereof

• US 20090105532A1
• Filed: 10/22/2007
• Published: 04/23/2009
• Est. Priority Date: 10/22/2007
• Status: Abandoned Application

• Current Assignee: Given Imaging Limited (Medtronic Plc)
• Original Assignee: Given Imaging Limited (Medtronic Plc)
• Inventors: Gilad, Zvika
• Application Number:
  US11/976,106
• Publication Number:
  US 20090105532A1
• Time in Patent Office: Days
• US Class Current: 600/101
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 1/273 for the upper alimentary canal, e.g. oesophagoscopes, gastroscopes
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/56 provided with illuminating means
• CPC Class Codes: H04N 7/185 from a mobile camera, e.g. for remote control

Abstract

A method of manufacturing an in vivo imaging device comprising the steps of: coating an electrical component with a scaffold micro-structure; assembling the micro-structure on a circuit board; and encapsulating the circuit board in a swallowable capsule.

Claims

1. A swallowable in-vivo imaging device comprising:

a circuit board;

an electronic component comprising a connecting unit, said connecting unit connectable to said circuit board; and

a micro-structure to support said electronic component, said micro-structure created by layering material over the electronic component.

2. The device of claim 1 wherein the electronic component is an antenna, an illumination unit, an irradiation unit or an integrated circuit component.

3. The device of claim 1 wherein a plurality of components are embedded into the micro-structure.

4. The device of claim 1 wherein the material is non-conductive.

5. A method of manufacturing an in-vivo imaging device comprising the steps of:

coating a component of the in-vivo imaging device with a scaffold micro-structure;

assembling the micro-structure on a circuit board; and

encapsulating the circuit board in a swallowable capsule.

6. The method of claim 5 wherein the component is partially coated by the micro-structure.

7. The method of claim 5 wherein the component is an electronic component.

8. The method of claim 7 wherein the electronic component includes electronic connectors, said connectors protruding from the micro-structure.

9. The method of claim 5 wherein a plurality of components are coated by the micro-structure.