METHOD FOR ANALYZING DEFECT DATA AND INSPECTION APPARATUS AND REVIEW SYSTEM
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Abstract
The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
24 Citations
32 Claims
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1-6. -6. (canceled)
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7. A method of analyzing defect date, comprising:
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generating a defect distribution map using information of positions of defects detected by an inspection apparatus; and classifying said defects that exist on said generated defect distribution map into one of a plurality of defect categories including a congestion defect, a linear distribution defect, a ring/lump distribution defect and a random distribution defect based on distance between adjacent defects and the local density of defects calculated from said defect distribution map. - View Dependent Claims (8, 9, 27)
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10. An apparatus for analyzing defect data, comprising:
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a first processor configured to generate a defect distribution map using information of positions of defects detected by an inspection apparatus; and a second processor configured to classify said defects that exist on said generated defect distribution map into one of a congestion defect, a linear distribution defect, a ring/lump distribution defect and a random distribution defect based on distance between adjacent defects and the local density of defects calculated from said defect distribution map generated by the first processor. - View Dependent Claims (11, 12, 28)
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13. A method of analyzing defect data, comprising the steps of:
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generating a defect distribution map using information of positions of defects detected by an inspection apparatus; and classifying said defects into one of a plurality of defect categories including a congestion defect, a linear distribution defect, a ring/lump distribution defect and a random distribution defect by using a Voronoi diagram which is generated based on position coordinates of said defects on said wafer map. - View Dependent Claims (14, 15, 29)
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16. An apparatus for analyzing defect data, comprising:
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a first processor configured to generate a defect distribution map using information of positions of defects detected by an inspection apparatus; and a second processor configured to classify said defects into one of a plurality of defect categories including a congestion defect, a linear distribution defect, a ring/lump distribution defect and a random distribution defect by generating a Voronoi diagram based on position coordinates of said defects on said wafer map. - View Dependent Claims (17, 18, 30)
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19. A method of analyzing defect data, comprising:
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generating a defect distribution map with positions of all defects by using position information of defects detected by an inspection apparatus; calculating distance between adjacent defects and a Voronoi region area by using a closest point Voronoi diagram corresponding to said defect distribution map; and discriminating a congestion defect on the basis of said distances between the adjacent defects; discriminating a linear distribution defect on the basis of said distance between the adjacent defects and said Voronoi region area; discriminating a ring/lump distribution defect on the basis of said distance between the adjacent defect and said Voronoi region area; and extracting another defect other than said congestion defect, said linear defect and said ring/lump distribution defect. - View Dependent Claims (20, 21, 22, 31)
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23. An apparatus for analyzing defect data, comprising:
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a defect distribution map generator configured to generate a defect distribution map with positions of all defects by using position information of defects detected by an inspection apparatus; a calculator configured to calculate distances between adjacent defects and a Voronoi region area by using a closest point Voronoi diagram corresponding to said defect distribution map; and a processor configured to classify said defects by discriminating a congestion defect on the basis of said distances between the adjacent defects, by discriminating a linear distribution defect on the basis of said distance between the adjacent defects and said Voronoi region area, by discriminating a ring/lump distribution defect on the basis of said distance between the adjacent defect and said Voronoi region area and by extracting another defect other than said congestion defect, said linear distribution defect and said ring/lump distribution defect. - View Dependent Claims (24, 25, 26, 32)
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Specification