Roughened Printed Circuit Board And Manufacturing Method Thereof

• US 20090106975A1
• Filed: 12/29/2008
• Published: 04/30/2009
• Est. Priority Date: 11/26/2004
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Ookawa, Tadao, Honjo, Mitsuru, Oda, Takashi
• Granted Patent: US 8,522,427 B2
• Time in Patent Office: Days
• US Class Current: 29/846
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/002 by liquid chemical etching
• CPC Class Codes: H05K 3/0041 by plasma etching
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/53504 One work part comprising paper clip

Abstract

A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Claims

1. A method of manufacturing a printed circuit board, comprising the steps of:

forming a conductive layer having a prescribed pattern on one or both surfaces of an insulating layer; and

roughening the region excluding said conductive layer on the surface of said insulating layer having said conductive layer thereon.

2. The method according to claim 1, wherein said step of roughening the region excluding said conductive layer comprises the step of roughening said insulating layer positioned in the region excluding said conductive layer by wet etching, wet blasting or dry etching process.

3. The method according to claim 1, wherein said step of forming a conductive layer having a prescribed pattern comprises the step of forming said conductive layer including a thin metal film layer so that said thin metal film layer is in contact with one or both surfaces of said insulating layer.