COMPOSITE SUBSTRATE

• US 20090107704A1
• Filed: 01/05/2009
• Published: 04/30/2009
• Est. Priority Date: 03/22/2005
• Status: Active Grant

• Current Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Universiteit Gent Vzw
• Original Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Universiteit Gent Vzw
• Inventors: Vanfleteren, Jan, Axisa, Fabrice, Brosteaux, Dominique
• Granted Patent: US 8,431,828 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/098 Special shape of the cross-section of conductors, e.g. very thick plated conductors
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base

Abstract

A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.

Claims

1. A composite substrate, comprising:

a stretchable and/or flexible material; and

patterned features embedded in the stretchable and/or flexible material, the patterned features comprising one or more patterned conducting layers.

2. The composite substrate according to claim 1, wherein the patterned features have a shape such that the patterned features are anchored into the stretchable and/or flexible material.

3. The composite substrate according to claim 1, wherein the patterned features comprise sloped sidewalls such that the patterned features are anchored into the stretchable and/or flexible material.

4. The composite substrate according to claim 1, wherein the patterned features comprise a substantially trapezoidal shape.

5. The composite substrate according to claim 1, wherein the patterned structures are optically conducting or thermally conducting or electrically conducting.

6. The composite substrate according to claim 1, wherein the patterned features comprise a metal or a semiconductor material.

7. The composite substrate according to claim 1, further comprising a plurality of components in electrical or optical contact with the patterned features.

8. The composite substrate according to claim 7, wherein the patterned features form an interconnect section between the components.

9. The composite substrate according to claim 7, further comprising an underfill material in substantially the whole area confined by the patterned features and the components.

10. The composite substrate according to claim 7, wherein the components are located at the side where the patterned features are free of the stretchable and/or flexible material.

11. The composite substrate according to claim 10, further comprising a second layer of stretchable and/or flexible material surrounding the components.

12. The composite substrate according to claim 11, further comprising holes in the second layer of stretchable and/or flexible material.

13. The composite substrate according to claim 1, further comprising a local stiffener.

14. The composite substrate according to claim 13, wherein the local stiffener is rigid or flexible.

15. The composite substrate according to claim 13, wherein the local stiffener is provided by locally increasing the thickness of the flexible and/or stretchable material.

16. The composite substrate according to claim 1, wherein the stretchable and/or flexible material covers substantially all the top surface and sidewalls of the patterned features.

17. The composite substrate according to claim 1, wherein the stretchable and/or flexible material comprises at least one of the following:

silicone, latex, polyurethane, rubber, thermoplastic elestomers (TPE), and polyimide.

18. A composite substrate, comprising:

one or more patterned conducting layers comprising a plurality of patterned features; and

a stretchable and/or flexible material formed on top of and in between the patterned features.

19. The composite substrate according to claim 18, wherein the stretchable and/or flexible material covers substantially all the top surface and sidewalls of the patterned features.

20. The composite substrate according to claim 18, wherein the patterned features have a shape such that the patterned features are anchored into the stretchable and/or flexible material.