PIXEL STRUCTURE AND FABRICATION METHOD THEREOF
First Claim
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1. A fabrication method of a pixel structure, comprising:
- providing a substrate;
forming a gate and a pixel electrode on the substrate;
forming a dielectric layer and a semiconductor layer on the substrate;
patterning the dielectric layer and the semiconductor layer to form a patterned dielectric layer and a patterned semiconductor layer on the gate;
forming a conductive layer on the substrate;
providing a photomask and performing a first lithographic process to pattern the conductive layer by utilizing the photomask to form a source and a drain on the patterned semiconductor layer, the drain being electrically connected to the pixel electrode;
forming a passivation layer on the substrate; and
performing a second lithographic process by utilizing the photomask to form a patterned passivation layer covering the source, the drain and the semiconductor layer and exposing a part of the pixel electrode.
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Abstract
A fabrication method of a pixel structure includes utilizing only a single photomask in two different lithographic processes for defining patterns of the source/drain and passivation layer respectively. Therefore, the total amount of photomasks of the fabrication process can be decreased.
24 Citations
24 Claims
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1. A fabrication method of a pixel structure, comprising:
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providing a substrate; forming a gate and a pixel electrode on the substrate; forming a dielectric layer and a semiconductor layer on the substrate; patterning the dielectric layer and the semiconductor layer to form a patterned dielectric layer and a patterned semiconductor layer on the gate; forming a conductive layer on the substrate; providing a photomask and performing a first lithographic process to pattern the conductive layer by utilizing the photomask to form a source and a drain on the patterned semiconductor layer, the drain being electrically connected to the pixel electrode; forming a passivation layer on the substrate; and performing a second lithographic process by utilizing the photomask to form a patterned passivation layer covering the source, the drain and the semiconductor layer and exposing a part of the pixel electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A fabrication method of a pixel structure, comprising:
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providing a substrate; forming a transparent conductive layer and a metal layer on the substrate in sequence; patterning the transparent conductive layer and the metal layer to form a gate and a pixel electrode stack layer, wherein the gate and the pixel electrode stack layer both comprise the transparent conductive layer and the metal layer; forming a dielectric layer and a semiconductor layer on the substrate; patterning the dielectric layer and the semiconductor layer to form a patterned dielectric layer and a patterned semiconductor layer on the gate; forming a conductive layer covering the substrate; providing a photomask and performing a first lithographic process to pattern the conductive layer and the metal layer by utilizing the photomask so as to form a source and a drain and to expose a part of the transparent conductive layer of the pixel electrode stack layer as a pixel electrode; forming a passivation layer on the substrate; and performing a second lithographic process by utilizing the photomask to form a patterned passivation layer covering the source, the drain and the semiconductor layer and expose a part of the pixel electrode. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A pixel structure, comprising:
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a substrate; a gate and a pixel electrode, disposed on the substrate; a patterned dielectric layer and a patterned semiconductor layer, disposed on the gate; a source and a drain disposed on two sides of the patterned semiconductor layer respectively; and a passivation layer disposed on the source, the drain and the semiconductor layer, the passivation layer completely covering sidewall surfaces of the source and the drain and exposing a part of the pixel electrode. - View Dependent Claims (22, 23, 24)
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21. The pixel structure of claim 21, wherein the passivation layer is at least 0.5 μ
- m wider than the source or the drain.
Specification