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SEMICONDUCTOR DEVICE

  • US 20090108440A1
  • Filed: 10/26/2007
  • Published: 04/30/2009
  • Est. Priority Date: 10/26/2007
  • Status: Active Grant
First Claim
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1. An arrangement, comprising:

  • a plurality of semiconductor chips arranged side by side in a spaced apart relationship;

    a first material filling at least partly the spacings between adjacent semiconductor chips; and

    a second material arranged over the semiconductor chips and the first material,wherein a coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.

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