Integrated Circuit Device Including A Contactless Integrated Circuit Inlay

• US 20090108974A1
• Filed: 10/31/2007
• Published: 04/30/2009
• Est. Priority Date: 10/31/2007
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Raggam, Peter, Grieshofer, Thomas
• Granted Patent: US 7,926,728 B2
• Time in Patent Office: Days
• US Class Current: 336/105
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.

Claims

1. An integrated circuit device including a contactless integrated circuit inlay, the integrated circuit device comprising:

a substrate;

an integrated circuit coupled to the substrate; and

a coil electrically coupled to the integrated circuit and coupled to the substrate;

wherein the coil comprises a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.

2. The integrated circuit device of claim 1, wherein the second conductive line is sandwiched between successive turns of the first conductive line.

3. The integrated circuit device of claim 1, wherein the first conductive line is sandwiched between successive turns of the second conductive line.

4. The integrated circuit device of claim 1, wherein the coil comprises an antenna portion electrically coupled between a first terminal and a second terminal of the integrated circuit.

5. The integrated circuit device of claim 4, wherein the first conductive line extends from the first terminal and the second conductive line extends from the second terminal.

6. The integrated circuit device of claim 1, wherein the first conductive line and the second conductive line comprise a conductive etch.

7. The integrated circuit device of claim 1, wherein the first conductive line and the second conductive line comprise a metal wire that is disposed on the substrate.

8. The integrated circuit device of claim 1, wherein the first and second conductive lines do not contact each other.

9. A contactless integrated circuit inlay comprising:

a substrate;

an integrated circuit coupled to the substrate;

a coil electrically coupled to the integrated circuit and coupled to the substrate; and

a line capacitor extending from the integrated circuit, the line capacitor separate from the coil and comprising a first conductor disposed on a first surface of the substrate adjacent to a second conductor disposed on the first surface of the substrate.

10. The contactless integrated circuit inlay of claim 9, wherein the coil comprises an antenna configured to communicate at about 13.56 MHz and the line capacitor is disposed on the first surface of the substrate entirely within a perimeter of the antenna.

11. The contactless integrated circuit inlay of claim 9, wherein the second conductor extends from a terminal of the integrated circuit and is disposed on the substrate in a pattern of turns having a decreasing radius and the first conductor is disposed between two adjacent turns of the second conductor.

12. The contactless integrated circuit inlay of claim 9, wherein the first conductor extends from a terminal of the integrated circuit and is disposed on the substrate in a pattern of turns having a decreasing radius and the second conductor is disposed between two adjacent turns of the first conductor.

13. The contactless integrated circuit inlay of claim 9, wherein the first conductor and the second conductor each comprise a conductive etch.

14. The contactless integrated circuit inlay of claim 9, wherein the first conductor and the second conductor comprise a metal wire that is disposed on the substrate.

15. The contactless integrated circuit inlay of claim 9, wherein the second conductor is spaced a distance away from the first conductor by between about 150-250 micrometers.

16. A contactless information read/write system comprising:

a reader/writer configured to generate electromagnetic waves; and

a card including a coil configured to wirelessly communicate with the electromagnetic waves of the reader/writer, the card comprising an integrated circuit inlay including a chip disposed on a substrate;

wherein the coil is electrically coupled to the chip and comprises a first line conductor disposed on a first surface of the substrate between at least two turns of a second line conductor disposed on the first surface of the substrate.

17. The system of claim 16, wherein the first line conductor is disposed in multiple turns on the first surface of the substrate.

18. The system of claim 16, wherein the second line conductor is sandwiched between multiple successive turns of the first line conductor.

19. The system of claim 16, wherein the second line conductor is sandwiched between successive turns of the first line conductor.

20. The system of claim 16, wherein the coil comprises an antenna portion electrically coupled between a first terminal and a second terminal of the integrated circuit and a line capacitor including the first and second line conductors, the line capacitor disposed entirely within a perimeter of the antenna portion.

21. A method of fabricating an integrated circuit inlay comprising:

providing a substrate including an integrated circuit coupled to the substrate;

depositing a coil on the substrate and coupling the coil to the integrated circuit;

depositing a first conductor line on the substrate that is connected to the integrated circuit; and

depositing a second conductor line on the substrate that is connected to the integrated circuit and adjacent to the first conductor line.

22. The method of claim 21, wherein depositing a first conductor line on the substrate comprises depositing multiple turns of a first conductor line on the substrate within a perimeter of the coil.

23. The method of claim 22, wherein depositing multiple turns of a first conductor line on the substrate comprises etching multiple turns of a first metal conductor line on the substrate, each succeeding turn having a radius that is less than a radius of a previous turn.

24. The method of claim 23, wherein depositing a second conductor line on the substrate adjacent to the first conductor line comprises etching multiple turns of a second conductor line on the substrate between the turns of the first metal conductor line.

25. The method of claim 24, further comprising:

selectively tuning inductance of the inlay by selectively spacing the second conductor line between the turns of the first metal conductor line.