APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

• US 20090109617A1
• Filed: 10/23/2008
• Published: 04/30/2009
• Est. Priority Date: 10/25/2007
• Status: Active Grant

• Current Assignee: Revolution Lighting Technologies, Inc.
• Original Assignee: Nexxus Lighting, Inc.
• Inventors: GRAJCAR, Zdenko
• Granted Patent: US 7,911,797 B2
• Time in Patent Office: Days
• US Class Current: 361/688
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad.

Claims

1. A circuit comprising:

a printed circuit board (PCB), the PCB defines a first surface and a second surface, the PCB includes a core, the core defines a first core surface and a second core surface;

an electronics package, the electronics package secured to the first surface of the PCB; and

a plurality of pins, each pin of the plurality of pins having a first end and a second end, the pins disposed about the PCB with at least one of the first ends proximate the electronics package such that a portion of the heat generated by the electronics package may be received by at least one of the pins, the pins configured to pass through the core generally from the first core surface to the second core surface to conduct the portion of the heat generated by the electronics package through the core for dissipation.

2. The circuit according to claim 1, further comprising a backplane having a backplane first surface and a backplane second surface, the backplane first surface affixed to the core second surface.

3. The circuit according to claim 2, further comprising a heat sink panel secured to the backplane second surface, the plurality of pins passing through the backplane and into the heat sink panel for dispersing heat.

4. The circuit of claim 2, wherein a portion of a metal layer forms at least one trace on the first core surface and the plurality of pins are configured to pass at least partially through the at least one trace, the core and the backplane, the backplane configured with cavities that pass about respective pluralities of pins to prevent short circuiting between the plurality of pins.

5. The circuit of claim 2, wherein the backplane comprises an electrically conductive material.

6. The circuit of claim 2, wherein the backplane comprises a thermally conductive material and portions of the plurality of pins extend into at least a portion of the backplane to conduct heat generated by the electronics package to the backplane to be dispersed.

7. The circuit of claim 1, wherein the plurality of pins comprises in any combination at least one of:

copper, brass, steel, aluminum and a metal alloy.

8. The circuit of claim 1, wherein a cross-section of the plurality of pins is constant between the first end and the second end.

9. The circuit of claim 1, wherein a cross-section of at least one of the plurality of pins is tapered between the first end and the second end.

10. The circuit of claim 1, wherein a cross-section of at least one of the plurality of pins forms a polygon.

11. The circuit of claim 1, wherein a cross-section of at least one of the plurality of pins forms a circular shape.

12. The circuit of claim 1, wherein at least one of the plurality of pins is configured to be threadedly received into the PCB.

13. The circuit of claim 1, wherein at least one of the plurality of pins is configured to be slideably received into the PCB.

14. The circuit according to claim 1, wherein the plurality of pins extend beyond the second core surface to define an extension portion, the extension portion dispersing the conducted heat by convection and/or radiation.

15. The circuit of claim 1, wherein a portion of a metal layer forms at least one trace on the first core surface with the electronics package in electrical communication with the at least one trace.

16. The circuit of claim 15, wherein the metal layer forms a pad having a pad first surface and a pad second surface, the pad electrically isolated from the at least one trace.

17. The circuit of claim 1, wherein a metal layer forms a pad having a pad first surface and a pad second surface, and wherein the electronics package has a package first surface and a package second surface, wherein a portion of the package second surface abuts a portion of the pad first surface.

18. The circuit of claim 17, wherein the electronics package is in thermal communication with the pad to distribute heat away from the electronics package.

19. The circuit of claim 17, wherein the plurality of pins pass at least in part through the pad to conduct heat away from the electronics package.

20. The circuit of claim 19, wherein the plurality of pins are configured to be biased against the pad second surface.

21. The circuit of claim 17, further comprising a heat slug, the heat slug secured to the pad so that the electronics package is in thermal communication with the heat slug and the plurality of pins.

22. The circuit of claim 21, wherein at least one of the plurality of pins is proximate the heat slug.

23. The circuit of claim 21, wherein at least one of the plurality of pins pass through at least a portion of the heat slug.

24. The circuit according to claim 17, further comprising a backplane having a backplane first surface and a backplane second surface, the backplane first surface affixed to the core second surface, the plurality of pins passing through at least a portion of the pad and through the core and into at least a portion of the backplane to dissipate heat.

25. The circuit of claim 24, further comprising a heat slug, the heat slug secured to the pad so that the electronics package is in thermal communication with the heat slug and the plurality of pins.

26. The circuit of claim 1, wherein a portion of a metal layer forms at least one trace on the first core surface and at least one of the plurality of pins is configured to pass at least partially through the at least one trace and the core, the core electrically isolating the at least one pin from at least one other of the plurality of pins.

27. The circuit of claim 1, wherein the electronic package includes at least one light emitting diode (LED).

28. The circuit of claim 1, wherein the electronic package comprises in any combination:

one or more lighting devices, a computing device, a memory storage device, and a communication device.

29. An apparatus that comprises the circuit of claim 1.

31. The method of claim 29, further comprising the step of providing a backplane having a backplane first surface and a backplane second surface, the backplane first surface being affixed to the core second surface.

32. The method of claim 31, further including the steps of forming a pad in a metal layer so that the electronics package abuts a portion of the pad.

33. The method of claim 32, further including passing the plurality of pins pass at least in part through the pad to conduct heat away from the electronics package.

34. The method of claim 32, further including the step of providing a heat slug, the heat slug being secured to the pad so that the electronics package is in thermal communication with the heat slug and the plurality of pins.

35. The method of claim 34, wherein the step of providing a heat slug includes configuring the at least one of the plurality of pins and the heat slug proximate to one another.

36. The method of claim 34, wherein the step of providing a heat slug includes passing at least one of the plurality of pins pass through at least a portion of the heat slug.

30. A method of dissipating heat in a circuit, the method comprising the steps of:

providing a printed circuit board (PCB), the PCB defining a first surface and a second surface, the PCB including a core, the core defining a first core surface and a second core surface;

providing an electronics package, the electronics package being secured to the first surface of the PCB; and

providing a plurality of pins, each pin of the plurality of pins having a first end and a second end, the pins being disposed about the PCB with the first ends proximate the electronics package such that at least a portion of the heat generated by the electronics package are received by the pins, the pins configured to pass through the core generally from the first core surface to the second core surface to conduct at least a portion of heat generated by the electronics package through the core for dissipation.