METHODS FOR BONDING HIGH TEMPERATURE SENSORS

• US 20090110845A1
• Filed: 10/30/2007
• Published: 04/30/2009
• Est. Priority Date: 10/30/2007
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Flanagan, Kevin Warner, Lu, Qiwei, Dris, Irene, Perry, Robert James, Lin, Wendy Wen-Ling, Fan, Ying, Barshinger, James Norman
• Application Number:
  US11/927,756
• Publication Number:
  US 20090110845A1
• Time in Patent Office: Days
• US Class Current: 427/543
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive
• CPC Class Codes: G01N 2291/02854 Length, thickness
• CPC Class Codes: G01N 2291/044 Internal reflections (echoes), e.g. on walls or defects
• CPC Class Codes: G01N 29/2475 Embedded probes, i.e. probes incorporated in objects to be inspected
• CPC Class Codes: H01L 2224/8388 Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

The invention provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a first surface of the sensor. The first surface of the sensor is contacted with a surface of an object to be monitored, wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. The invention also provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a surface area of an object to be monitored. The first surface of a sensor is contacted with the object surface area, wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250° C.

Claims

1. A method of bonding a sensor to a surface comprising the steps of:

applying a thermoplastic film to a first surface of a sensor; and

contacting the first surface of the sensor to a surface of an object to be monitored;

wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250°

C.

2. The method of claim 1, wherein the thermoplastic film is applied to the first surface of the sensor by compression molding, laminating, spraying, powder coating or a combination thereof.

3. The method of claim 1, further comprising:

melting the thermoplastic film prior to, during, or after contacting the first surface of the sensor with the object surface.

4. The method of claim 1, wherein the thermoplastic film is melted by sonication, pressure, heat or a combination thereof.

5. The method of claim 4, wherein the thermoplastic film is melted by induction heating.

6. The method of claim 1, wherein the thermoplastic film is capable of effectively bonding the sensor to the object surface for a period of approximately five years.

7. The method of claim 1, wherein the thermoplastic film has a softening point of about 200°

C. to about 400°

C.

8. The method of claim 1, wherein the thermoplastic film has a thickness between approximately 1 mil and approximately 2 mm.

9. The method of claim 1, wherein the thermoplastic film is comprised of polysulfone, poly(phenylene sulfide), polyimide, poly(ether ether ketone), poly(ether ketone), poly(ether ketone ketone), liquid crystalline polyester, or poly(arylene ether).

10. The method of claim 1, further comprising:

treating the object surface via acid etch, grit blasting, vapor blasting, silane treatment, silicon sputtering, anodization, corona discharge, or a combination thereof;

prior to contacting the first surface of the sensor to the surface of the object.

11. A method of bonding a sensor to a surface comprising the steps of:

applying a thermoplastic film to a surface area of an object to be monitored; and

contacting a first surface a sensor to the object surface area;

wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250°

C.

12. The method of claim 11, wherein the thermoplastic film is applied to the object surface by induction welding, laminating, spraying, powder coating or a combination thereof.

13. The method of claim 11, further comprising:

melting the thermoplastic film prior to, during, or after contacting the first surface of the sensor with the object surface.

14. The method of claim 13, wherein the thermoplastic film is melted by sonication, pressure, heat or a combination thereof.

15. The method of claim 14, wherein the thermoplastic film is melted by induction heating.

16. The method of claim 11, wherein the thermoplastic film is capable of effectively bonding the sensor to the surface for a period of approximately five years.

17. The method of claim 11, wherein the thermoplastic film has a softening point of about 200°

C. to about 400°

C.

18. The method of claim 11, wherein the thermoplastic film has a thickness between approximately 1 mil and approximately 2 mm.

19. The method of claim 11, wherein the thermoplastic film is comprised of polysulfone, poly(phenylene sulfide), polyimide, poly(ether ether ketone), poly(ether ketone), poly(ether ketone ketone), liquid crystalline polyester, or poly(arylene ether).

20. The method of claim 11, further comprising:

treating the object surface via acid etch, grit blasting, vapor blasting, silane treatment, silicon sputtering, anodization, corona discharge, or a combination thereof;

prior to contacting the first surface of the sensor to the surface of the object.