Apparatus and Method for Manufacturing an Electronic Package
First Claim
1. An apparatus to package an electronic device comprising:
- a molding area to inject at least one plastic composite material and support an electronic component inserted therein; and
at least one injection nozzle to inject a specified level of the at least one plastic composite material into the molding area to substantially surround the electronic component and to produce a substantially hermetic sealed package substantially resistant to shock and vibration.
9 Assignments
0 Petitions
Accused Products
Abstract
An apparatus to package an electronic device. The apparatus includes a composite plastic package that is durable to environmental conditions. In particular, a mold process to produce a plastic composite material package and support an electronic component inserted therein. At least one injection nozzle supplies a specified level of plastic composite material into the mold to produce a substantially hermetically sealed package. A multi-patch antenna provides increased receiver sensitivity. An inductive battery power option provides a user flexibility to charge a tracking device and communicate near-field signals and energy with a tracking monitoring station.
145 Citations
30 Claims
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1. An apparatus to package an electronic device comprising:
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a molding area to inject at least one plastic composite material and support an electronic component inserted therein; and at least one injection nozzle to inject a specified level of the at least one plastic composite material into the molding area to substantially surround the electronic component and to produce a substantially hermetic sealed package substantially resistant to shock and vibration. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An injection-molded article comprising:
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an integrated circuit disposed on a substrate; a first protective molding formed by a first thermoplastic resin disposed on the integrated circuit; and a second protective molding formed by a second thermoplastic resin to substantially cover at least a portion of an exposed area of the substrate; wherein the first and the second protective moldings are injected as an overmolding material into a mold tool to substantially selectively provide low-loss communication to wireless communication networks and provide a package to the integrated circuit that has resistance to moisture and shock variation. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A tracking device comprising:
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a transceiver; a printed circuit board substrate comprising wireless location and tracking circuitry to assist in monitoring location coordinates of an object or individual attached thereto; a first patch antenna mounted on a first side of the tracking device; a second patch antenna disposed substantially parallel to the first patch antenna and mounted on a second side opposed to the first side of the tracking device; wherein the first patch antenna and the second patch antenna are configured to periodically communicate signals to the wireless location and tracking circuitry processor to determine if the first patch antenna or the second patch antenna provides optimal antenna performance when the transceiver is placed in a low-power mode; and wherein the signals comprise at least one of periodic or a periodic sampling interval substantially less than a duration of a communicated location and tracking signal. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification