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Apparatus and Method for Manufacturing an Electronic Package

  • US 20090111393A1
  • Filed: 10/31/2007
  • Published: 04/30/2009
  • Est. Priority Date: 10/31/2007
  • Status: Active Grant
First Claim
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1. An apparatus to package an electronic device comprising:

  • a molding area to inject at least one plastic composite material and support an electronic component inserted therein; and

    at least one injection nozzle to inject a specified level of the at least one plastic composite material into the molding area to substantially surround the electronic component and to produce a substantially hermetic sealed package substantially resistant to shock and vibration.

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