COOLING STRUCTURE FOR ELECTRIC DEVICE

• US 20090114371A1
• Filed: 10/26/2006
• Published: 05/07/2009
• Est. Priority Date: 10/28/2005
• Status: Abandoned Application

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Asakura, Ken
• Application Number:
  US12/091,923
• Publication Number:
  US 20090114371A1
• Time in Patent Office: Days
• US Class Current: 165/104.130
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A cooling structure for an electric device includes an inverter, a plurality of cooling medium paths (724) through which a cooling medium for the inverter flows, and an inlet (722) into which the cooling medium to be supplied to the plurality of cooling medium paths (724) flows. The plurality of cooling medium paths (724) extend in a direction crossing the aligning direction of the inlet (722) and the plurality of cooling medium paths (724). The cooling structure for an electric device further includes a cooling medium distribution mechanism for promoting distribution of the cooling medium to each of cooling medium paths (724) by suppressing the flow of the cooling medium. The cooling medium distribution mechanism has a flow rate suppression function suppressing the flow rate of the cooling medium flowing through at least one cooling medium path (724). This flow rate suppression function is realized by a wall (726A, 726B, 726C) provided at a cooling medium path (724).

Claims

1. A cooling structure for an electric device, comprising:

an electric device including a plurality of electric elements,

a casing on which said plurality of electric elements are mounted,

a plurality pf cooling medium paths, formed in said casing, through which a cooling medium for said electric device flows, and

an inlet into which said cooling medium to be supplied to said plurality of cooling medium paths flows,

said plurality of cooling medium paths extending in a direction crossing an aligning direction of said inlet and said plurality of cooling medium paths,

said cooling structure for an electric device further comprising;

a cooling medium distribution mechanism promoting distribution of the cooling medium to each of said cooling medium paths by suppressing a flow of the cooling medium,

said cooling medium distribution mechanism having a flow rate suppression function to suppress a flow rate of the cooling medium flowing through at least one said cooling medium path, and

a level of suppressing the flow rate at said plurality of coolant medium paths being altered such that a flow of said cooling medium into said cooling medium path located relatively distant from said inlet is relatively promoted while the flow of said cooling medium into said cooling medium path located relatively close to said inlet is relatively suppressed.

3. The cooling structure for an electric device according to claim 1, wherein said flow rate suppression function is realized by a wall at the cooling medium path provided so as to cross said cooling medium path.

4. The cooling structure for an electric device according to claim 3, wherein said wall is selectively provided at said cooling medium path located close to said inlet.

7. The cooling structure for an electric device according to claim 1, wherein said electric device includes an inverter.

2. (canceled)

5. A cooling structure for an electric device, comprising:

an electric device,

a plurality of cooling medium paths through which a cooling medium for said electric device flows, and

an inlet into which said cooling medium to be supplied to said plurality of cooling medium paths flows,

said plurality of cooling medium paths extending in a direction crossing an aligning direction of said inlet sand said plurality of cooling medium paths,

said cooling structure for an electric device further comprising;

a cooling medium distribution mechanism promoting distribution of the cooling medium to each of said cooling medium paths by suppressing a flow of the cooling medium,

said cooling medium distribution mechanism having a flow rate suppression function to suppress a flow rate of the cooling medium flowing through at least one of said cooling medium path,

said flow rate suppression mechanism being realized by a wall at a cooling medium path provided so as to cross said cooling medium path,

said wall being provided at each of said plurality of cooling medium paths differing in distance from each other from said inlet, and

the walls provided at said plurality of said cooling medium paths differing in height from each other.

6. The cooling structure for an electric device according to claim 5, wherein the height of said wall located at said cooling medium path distant from said inlet is relatively low, and

the height of said wall located at said cooling medium path close to said inlet is relatively high.

8. The cooling structure for an electric device according to claim 5, wherein said electric device includes an inverter.