ELECTRONIC COMPONENT

• US 20090114441A1
• Filed: 09/24/2008
• Published: 05/07/2009
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Hashimoto, Nobuaki
• Granted Patent: US 7,863,529 B2
• Time in Patent Office: Days
• US Class Current: 174/521
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H03H 9/1021 the BAW device being of the cantilever type
• CPC Class Codes: H03H 9/1092 the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Abstract

An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In the electronic component, the sealing member includes a core part formed on the first substrate and having elasticity and a metal film formed on a surface of the core part, and the metal film is bonded to the second substrate.

Claims

1. An electronic component, comprising:

a first substrate;

a second substrate;

a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and

a functional element at least a part of which is disposed in the sealing space, wherein

the sealing member includes a core part formed on the first substrate and having elasticity and a metal film formed on a surface of the core part, and the metal film is bonded to the second substrate.

2. The electronic component according to claim 1, wherein a bonding metal film metal-bonded with the metal film is formed in a region, the region contacting with the sealing member, of the second substrate.

3. The electronic component according to claim 2, wherein the metal film and the bonding metal film are bonded to each other at normal temperature.

4. The electronic component according to claim 1, wherein the sealing member is thermally compressed on the second substrate.

5. The electronic component according to claim 1, further comprising:

a maintaining member maintaining a bonding state between the metal film and the second substrate.

6. The electronic component according to claim 5, wherein the maintaining member surrounds a periphery of the sealing member.

7. The electronic component according to claim 1, wherein the functional element of which a characteristic is changed by at least one of stress and heat is placed on a face of one of the first substrate and the second substrate.

8. The electronic component according to claim 7, wherein the functional element is directly formed on a face of one of the first substrate and the second substrate.

9. The electronic component according to claim 7, wherein the functional element is placed and bonded on a face of one of the first substrate and the second substrate.