METHODS AND APPARATUSES FOR FORMING CUTTING ELEMENTS HAVING A CHAMFERED EDGE FOR EARTH-BORING TOOLS

• US 20090114628A1
• Filed: 11/05/2008
• Published: 05/07/2009
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: Baker Hughes Holdings LLC (Baker Hughes Company)
• Original Assignee: Baker Hughes Incorporated (Baker Hughes Company)
• Inventors: DiGiovanni, Anthony A.
• Granted Patent: US 9,259,803 B2
• Time in Patent Office: Days
• US Class Current: 219/121.720
• CPC Class Codes: B23K 2101/002 Drill-bits
• CPC Class Codes: B23K 26/0823 Devices involving rotation of the workpiece
• CPC Class Codes: B23K 26/10 using a fixed support , i.e. involving moving the laser beam
• CPC Class Codes: B23K 26/103 the laser beam rotating around the fixed workpiece B23K26/28 takes precedence
• CPC Class Codes: B23K 26/146 the fluid stream containing a liquid
• CPC Class Codes: B23K 26/3576 Diminishing rugosity, e.g. grinding; Polishing; Smoothing
• CPC Class Codes: B23K 26/36 Removing material B23K26/55, B23K26/57 take precedence
• CPC Class Codes: E21B 10/567 with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts

Abstract

Apparatuses for forming chamfers on superabrasive tables of cutting elements for earth-boring tools include a chuck for temporarily holding and positioning a cutting element, and at least one emitter for emitting a beam of energy toward an edge of a superabrasive table of a cutting element held and positioned by the chuck. Methods of forming cutting elements for earth-boring tools and methods for forming earth-boring tools are also disclosed.

Claims

1. An apparatus for forming a chamfer on a cutting element for an earth-boring tool, comprising:

a device configured to temporarily hold and position a cutting element for an earth-boring tool; and

at least one emitter configured and oriented to emit a beam of energy toward an edge of a superabrasive table of a cutting element held and positioned by the device.

2. The apparatus of claim 1, wherein the device configured to temporarily hold and position a cutting element is configured to rotate a cutting element about a longitudinal axis.

3. The apparatus of claim 1, wherein the at least one emitter is configured to rotate around a cutting element held by the device.

4. The apparatus of claim 1, further comprising structure configured to manipulate the beam of energy emitted by the at least one emitter to adjust a direction of the beam of energy.

5. The apparatus of claim 1, wherein the at least one emitter is oriented to direct the beam of energy toward an edge of a superabrasive table of a cutting element in a direction at least substantially perpendicular to a longitudinal axis of a cutting element held by the device.

6. The apparatus of claim 1, wherein the at least one emitter is oriented to direct the beam of energy toward an edge of a superabrasive table of a cutting element in a direction at least substantially parallel to a longitudinal axis of a cutting element held by the device.

7. The apparatus of claim 1, wherein the at least one emitter is oriented to direct the beam of energy toward an edge of a superabrasive table of a cutting element in a direction oriented at an acute angle to a longitudinal axis of a cutting element held by the device.

8. The apparatus of claim 7, wherein the acute angle is selected from a range of angles between 15 degrees and about 75 degrees.

9. The apparatus of claim 1, wherein the at least one emitter comprises a laser.

10. The apparatus of claim 9, wherein the at least one emitter comprising a laser is configured as an Nd-YAG laser or an ArF excimer laser.

11. The apparatus of claim 1, wherein the at least one emitter is configured to emit a particle beam.

12. The apparatus of claim 11, wherein the at least one emitter is configured to emit a beam of ions or a beam of molecules.

13. The apparatus of claim 1, further comprising at least one gas jet positioned and oriented to direct a stream of gas toward an edge of a superabrasive table of a cutting element held by the device.

14. The apparatus of claim 13, wherein the at least one gas jet is positioned and oriented to direct a predominant velocity vector of the stream of gas at least substantially parallel to a velocity vector of an edge of a superabrasive table of a cutting element held by the device.

15. The apparatus of claim 13, wherein the at least one gas jet is positioned and oriented at an acute angle relative to a longitudinal axis of a cutting element held by the device.

16. A method of forming a cutting element, comprising:

forming a layer of superabrasive material on a substrate; and

forming a chamfer at least partially along a peripheral edge of the layer of superabrasive material using an energy beam.

17. The method of claim 16, wherein forming a layer of superabrasive material comprises forming a layer of polycrystalline diamond.

18. The method of claim 17, wherein forming a layer of polycrystalline diamond comprises forming the layer of polycrystalline diamond comprising a cobalt binder, and further comprising at least partially removing the cobalt binder from the layer of polycrystalline diamond prior to forming the chamfer using the energy beam.

19. The method of claim 16, wherein using an energy beam comprises using a laser beam or a particle beam.

20. The method of claim 16, further comprising polishing the chamfer using at least one additional energy beam.

21. The method of claim 16, further comprising:

depositing an additional layer of material over at least a portion of the layer of superabrasive material;

directing the energy beam onto an exposed surface of the additional layer of material; and

transferring energy from the additional layer of material to the layer of superabrasive material.

22. The method of claim 16, wherein forming the chamfer at least partially along the peripheral edge of the layer of superabrasive material using the energy beam comprises:

temporarily securing the substrate in a chuck;

directing at least one energy beam onto an edge of the superabrasive material; and

moving a point of contact between the energy beam and the superabrasive material along the edge to form the chamfer.

23. A method for forming an earth-boring tool, comprising:

temporarily securing a cutting element for an earth-boring tool in a chuck;

directing at least one energy beam onto an edge of a superabrasive table of the cutting element;

moving a point of contact between the at least one energy beam and the superabrasive table along the edge to form a chamfer along at least a portion of the edge; and

securing the cutting element to a body of an earth-boring tool.

24. The method of claim 23, wherein directing at least one energy beam comprises directing the at least one energy beam onto the edge of the superabrasive table of the cutting element in a direction at least substantially perpendicular to a longitudinal axis of the cutting element.

25. The method of claim 23, wherein directing at least one energy beam comprises directing the at least one energy beam onto the edge of the superabrasive table of the cutting element in a direction at least substantially parallel to a longitudinal axis of the cutting element.

26. The method of claim 23, wherein directing at least one energy beam comprises directing the at least one energy beam onto the edge of the superabrasive table of the cutting element in a direction oriented at an acute angle to a longitudinal axis of the cutting element.

27. The method of claim 23, further comprising disposing a thin film material over at least a portion of the superabrasive table prior to directing the at least one energy beam onto the edge of the superabrasive table, the thin film material comprising a material that is reactive with the material comprising the superabrasive table.

28. The method of claim 23, wherein moving a point of contact between the at least one energy beam and the superabrasive table along the edge to form a chamfer along at least a portion of the edge comprises rotating at least one of the chuck and an emitter configured to emit the at least one energy beam about a longitudinal axis of the cutting element.

29. The method of claim 23, wherein moving a point of contact between the at least one energy beam and the superabrasive table along the edge to form a chamfer along at least a portion of the edge comprises manipulating the at least one energy beam to adjust the direction thereof.

30. The method of claim 23, further comprising directing at least one stream of gas onto the point of contact between the energy beam and the superabrasive table.