PANEL STRUCTURE AND MANUFACTURING METHOD THEREOF

• US 20090114918A1
• Filed: 11/05/2008
• Published: 05/07/2009
• Est. Priority Date: 11/06/2007
• Status: Abandoned Application

• Current Assignee: Wintek Corporation
• Original Assignee: Wintek Corporation
• Inventors: Chu, Chien-Tzu, Wang, Wen-Chun, Kang, Hen-Ta
• Application Number:
  US12/265,085
• Publication Number:
  US 20090114918A1
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/1251 comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

A panel structure and a manufacturing method thereof are provided. The panel structure is disposed in a display device. The panel structure includes a substrate, several first transistors and second transistors. The substrate has a display circuit and a control circuit. The first transistors are disposed at the display circuit of the substrate. Each of the first transistors has a first active layer. The second transistors are disposed at the control circuit of the substrate. Each of the second transistors has a second active layer. The materials of at least one of the first active layer and the second active layer include ZnO.

Claims

1. A panel structure disposed in a display device, the panel structure comprising:

a substrate having a display circuit and a control circuit;

a plurality of first transistors disposed at the display circuit of the substrate, wherein each of the first transistors has a first active layer; and

a plurality of second transistors disposed at the control circuit of the substrate, wherein each of the second transistors has a second active layer, and the materials of at least one of the first active layer and the second active layer comprise ZnO.

2. The panel structure according to claim 1, wherein the control circuit comprises a signal control circuit and a scan control circuit, and the panel structure further comprises:

a plurality of third transistors disposed at the control circuit of the substrate, wherein each of the third transistors has a third active layer;

wherein, the second transistors are disposed at one of the signal control circuit and the scan control circuit, and the third transistors are disposed at the other one of the signal control circuit and the scan control circuit.

3. The panel structure according to claim 2, wherein structures of the second transistors and structures of the third transistors are the same.

4. The panel structure according to claim 2, wherein materials of the first active layer comprise ZnO, and materials of both the second active layer and the third active layer are ZnO or amorphous silicon (a-Si).

5. The panel structure according to claim 2, wherein materials of the second active layer comprise ZnO, and materials of both the first active layer and the third active layer are ZnO or amorphous silicon.

6. The panel structure according to claim 1, further comprising:

an insulation layer disposed on the substrate.

7. The panel structure according to claim 6, wherein each of the first transistors has a first gate and a first island structure, the first gate corresponds to the first island structure, the first gate is disposed between the substrate and the insulation layer, and the first island structure is disposed on the insulation layer.

8. The panel structure according to claim 7, wherein the first island structure has a first electrode layer, a first opening, a first ohm contact layer and the first active layer, the first active layer and the first ohm contact layer are sequentially disposed on the insulation layer, a part of the first electrode layer is disposed on the first ohm contact layer, another part of the first electrode layer is disposed on the insulation layer, and the first opening penetrates the first electrode layer and the first ohm contact layer and exposes the first active layer.

9. The panel structure according to claim 7, wherein each of the second transistors has a second gate and a second island structure, the second island structure corresponds to the second gate, the second island structure has a second electrode layer, a second opening and the second active layer, the second opening penetrates the second electrode layer, and the second active layer is disposed with respect to the second electrode layer.

10. The panel structure according to claim 9, wherein the second gate is disposed between the substrate and the insulation layer, and the second island structure is disposed on the insulation layer.

11. The panel structure according to claim 10, wherein the second electrode layer is disposed on the insulation layer, the second opening penetrates the second electrode layer and exposes the insulation layer, and the second active layer covers the second opening.

12. The panel structure according to claim 11, wherein each of the second transistors further has a second ohm contact layer, the second ohm contact layer is disposed on the second electrode layer, and the second opening also penetrates the second ohm contact layer.

13. The panel structure according to claim 10, wherein the second active layer is disposed on the insulation layer, the second electrode layer is disposed above the second active layer, and the second opening penetrates the second electrode layer and exposes the second active layer.

14. The panel structure according to claim 13, wherein each of the second transistors further has a second ohm contact layer, the second ohm contact layer is disposed between the second active layer and the second electrode layer, and the second opening also penetrates the second ohm contact layer.

15. The panel structure according to claim 9, wherein the second gate is disposed on the insulation layer, and the second island structure is disposed between the insulation layer and the substrate.

16. The panel structure according to claim 15, wherein the second electrode layer is disposed on the substrate, the second opening penetrates the second electrode layer and exposes the substrate, and the second active layer covers the second opening.

17. The panel structure according to claim 16, wherein each of the second transistors further has a second ohm contact layer, each of the first transistors further has a metal oxidation layer, the second ohm contact layer is disposed on the second electrode layer, the metal oxidation layer is disposed on the first gate, and the second opening also penetrates the second ohm contact layer.

18. The panel structure according to claim 15, wherein the second active layer is disposed on the substrate, a part of the second electrode layer is disposed above the second active layer, another part of the second electrode layer is disposed on the substrate, and the second opening penetrates the second electrode layer and exposes the second active layer.

19. The panel structure according to claim 18, wherein each of the second transistors further has a second ohm contact layer, each of the first transistors further has a metal oxidation layer, the second ohm contact layer is disposed between the second active layer and the second electrode layer and the substrate, the metal oxidation layer is disposed between the first gate and the substrate, and the second opening also penetrates the second ohm contact layer.

20. The panel structure according to claim 6, further comprising:

a pixel electrode electrically connected to the first transistors.

21. The panel structure according to claim 20, further comprising:

a passivation layer covering the first transistors and the second transistors.

22. A manufacturing method of a panel structure, comprising:

(a) providing a substrate; and

(b) forming a plurality of first transistors at the substrate to constitute a display circuit, and forming a plurality of second transistors at the substrate to constitute a control circuit, wherein each of the first transistors has a first active layer, each of the second transistors has a second active layer, and materials of at least one of the first active layer and the second active layer comprise ZnO.

23. The manufacturing method according to claim 22, wherein the control circuit comprises a signal control circuit and a scan control circuit, and the step (b) further comprises:

forming a plurality of third transistors at the control circuit of the substrate, wherein each of the third transistors has a third active layer;

wherein, the second transistors are disposed at one of the signal control circuit and the scan control circuit, and the third transistors are disposed at the other one of the signal control circuit and the scan control circuit.

24. The manufacturing method according to claim 23, wherein structures of the second transistors and structures of the third transistors are the same.

25. The manufacturing method according to claim 23, wherein materials of the first active layer comprise ZnO, and materials of both the second active layer and the third active layer are ZnO or amorphous silicon.

26. The manufacturing method according to claim 23, wherein materials of the second active layer comprise ZnO, and materials of both the first active layer and the third active layer are ZnO or amorphous silicon.

27. The manufacturing method according to claim 22, wherein the step (b) further comprises:

(b1) forming a first gate of each of the first transistors on the substrate, and forming a second gate of each of the second transistors on the substrate;

(b2) forming an insulation layer on the first gate, the second gate and the substrate; and

(b3) sequentially forming the first active layer and a material layer of a first ohm contact layer on the insulation layer.

28. The manufacturing method according to claim 27, wherein after the step (b3), the step (b) further comprises:

(b4) forming a first electrode layer on the material layer of the first ohm contact layer and the insulation layer, and forming a second electrode layer on the insulation layer, wherein the first electrode layer has a first opening, and the second electrode layer has a second opening;

(b5) etching the material layer of the first ohm contact layer at the first opening to form the first ohm contact layer; and

(b6) forming the second active layer to cover the second opening.

29. The manufacturing method according to claim 28, wherein after the step (b4) and before the step (b5), the step (b) further comprises:

(b41) forming a second ohm contact layer on the second electrode layer.

30. The manufacturing method according to claim 27, wherein after the step (b3), the step (b) further comprises:

(b4) forming the second active layer on the insulation layer;

(b5) forming a first electrode layer on the material layer of the first ohm contact layer and the insulation layer, and forming a second electrode layer above the second active layer, wherein the first electrode layer has a first opening, and the second electrode layer has a second opening; and

(b6) etching the material layer of the first ohm contact layer at the first opening to form the first ohm contact layer.

31. The manufacturing method according to claim 30, wherein after the step (b4) and before the step (b5), the step (b) further comprises:

(b41) forming a second ohm contact layer on the second active layer.

32. The manufacturing method according to claim 22, wherein the step (b) further comprises:

(b1) forming a first gate of each of the first transistors on the substrate, and forming a second electrode layer of each of the second transistors on the substrate, wherein the second electrode layer has a second opening;

(b2) forming the second active layer to cover the second opening;

(b3) forming an insulation layer above the first gate, the second electrode layer, the second active layer and the substrate;

(b4) sequentially forming the first active layer and a material layer of a first ohm contact layer on the insulation layer;

(b5) forming a first electrode layer on the material layer of the first ohm contact layer and the insulation layer, and forming a second gate on the insulation layer, wherein the first electrode layer has a first opening; and

(b6) etching the material layer of the first ohm contact layer at the first opening to form the first ohm contact layer.

33. The manufacturing method according to claim 32, wherein the step (b1) further comprises:

forming a second ohm contact layer on the second electrode layer, and forming a metal oxidation layer on the first gate, wherein the second opening also penetrates the second ohm contact layer.

34. The manufacturing method according to claim 22, wherein the step (b) further comprises:

(b1) forming the second active layer on the substrate;

(b2) forming a first gate of each of the first transistors above the substrate, and forming a second electrode layer above a part of the second active layer and a part of the substrate, wherein the second electrode layer has a second opening;

(b3) forming an insulation layer on the first gate, the second electrode layer, the second active layer and the substrate;

(b4) sequentially forming the first active layer and a material layer of a first ohm contact layer on the insulation layer;

(b5) forming a first electrode layer on the material layer of the first ohm contact layer and the insulation layer, and forming a second gate on the insulation layer, wherein the first electrode layer has a first opening; and

(b6) etching the material layer of the first ohm contact layer at the first opening to form the first ohm contact layer.

35. The manufacturing method according to claim 34, wherein the step (b2) further comprises:

forming a second ohm contact layer between the second electrode layer and the second active layer and the substrate, and forming a metal oxidation layer between the first gate and the substrate, wherein the second opening also penetrates the second ohm contact layer.

36. The manufacturing method according to claim 22, further comprising:

forming a pixel electrode to electrically connect the first transistors.

37. The manufacturing method according to claim 36, further comprising:

forming a passivation layer to cover the first transistors and the second transistors.