Led light emitter with heat sink holder and method for manufacturing the same

• US 20090114934A1
• Filed: 01/25/2008
• Published: 05/07/2009
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: Liung Feng Industrial Co., Ltd.
• Original Assignee: Liung Feng Industrial Co., Ltd.
• Inventors: Wuu, Dong-Sing, Horng, Ray-Hua, Chiang, Cheng-Chung, Hsiao, Hsiang-Yun, Lin, Heng-I, Hsu, Tsang-Lin
• Granted Patent: US 8,048,692 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32 of an individual layer connector
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat sink holder and at least an LED chip. The heat sink holder is made of high thermal conductivity coefficient, and includes a reflecting mirror having a central portion and a reflecting portion surrounding the central portion. A normal of a top surface of the reflecting portion forms an acute angle relative to a normal of a top surface of the central portion. The LED chip is unitarily connected with a top surface of the central portion, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film. The LED light emitter with heat sink holder improves heat dissipation and working duration.

Claims

1. An LED light emitter with heat sink holder, comprising:

a heat sink holder being made of material with high thermal conductivity coefficient, and including a reflecting mirror having a central portion and a reflecting portion surrounding the central portion, a normal of a top surface of the reflecting portion forming an acute angle relative to a normal of a top surface of the central portion; and

at least an LED chip being unitarily connected with a top surface of the central portion, and including a heat sink holder connecting with the top surface of the central portion, a light emitting film on the holder for emitting light by photoemission, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film.

2. The LED light emitter with a heat sink holder as recited in claim 1, wherein the heat sink holder includes a base, and the reflecting mirror is made of high reflective coefficient material and is provided on the base.

3. The LED light emitter with heat sink holder as recited in claim 2, wherein the base is formed of copper, gold, silver, nickel, tin, titanium, platina, palladium, tungsten, molybdenum, or any alloy with elements selected from the above.

4. The LED light emitter with heat sink holder as recited in claim 1, wherein the top surface of the reflecting portion is a smooth curved surface and substantially protrudes reverse to a bottom of the heat sink holder.

5. The LED light emitter with heat sink holder as recited in claim 1, wherein the light emitting film comprises a first coating layer and a second coating layer respectively doped to form different n-type or p-type, and an active layer between the first coating layer and the second coating layer and serving as a carrier barrier relative to the first coating layer and the second coating layer.

6. The LED light emitter with heat sink holder as recited in claim 5, wherein the light emitting film further comprises a transparent conductive layer made of transparent and conductive metal oxide and formed on the first coating layer.

7. The LED light emitter with heat sink holder as recited in claim 5, wherein the light emitting film further comprises a transparent conductive layer made of transparent and conductive metal oxide and formed on the second coating layer.

8. A method for manufacturing an LED light emitter with heat sink holder, comprising:

chip setting step, putting and fixing an LED chip on a support portion in such a way that a light emitting plane of the LED chip facing to the support portion, wherein the LED chip includes a heat sink holder, a light emitting film on the heat sink holder for generating light by photoemission, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film;

sacrificial layer forming step, forming a removable sacrificial layer on the support portion and around a peripheral of the LED chip, thickness of the sacrificial layer continuously reducing from a top of the LED chip to the support portion;

heat sink holder forming step, forming a heat sink holder from a bottom of the LED chip to the sacrificial layer with material of high thermal conductivity coefficient, the heat sink holder having a top surface substantially parallel to a bottom surface of the substrate; and

sacrificial layer removing step, removing the sacrificial layer to form the LED light emitter with heat sink holder.

9. The method for manufacturing an LED light emitter with heat sink holder as recited in claim 8, further comprising a chip manufacturing step for preliminarily forming an LED chip, the LED chip including a heat sink holder, a light emitting film on the heat sink holder for generating light by photoemission, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film.

10. The method for manufacturing an LED light emitter with heat sink holder as recited in claim 8, wherein thickness of the sacrificial layer continuously reducing along a smooth concave surface from a top of the LED chip to the support portion.

11. The method for manufacturing an LED light emitter with heat sink holder as recited in claim 8, wherein the heat sink holder forming step comprises forming a reflecting mirror from a bottom of the substrate of the LED chip to the sacrificial layer with material of high light reflectivity coefficient and high thermal conductivity coefficient, sequentially forming a base coated incrementally upward on the reflecting mirror with high thermal conductivity material, the reflecting mirror and the base together forming the heat sink holder.

12. The method for manufacturing an LED light emitter with heat sink holder as recited in claim 11, wherein the reflecting mirror is formed with at least two film portions which are arranged in such a way that a film portion of relatively high refractive index is overlapped with a film portion of relatively low refractive index.

13. The method for manufacturing an LED light emitter with heat sink holder as recited in claim 11, wherein the base is formed incrementally by electrical coating.