Electronic Circuit Package

• US 20090115051A1
• Filed: 11/01/2007
• Published: 05/07/2009
• Est. Priority Date: 11/01/2007
• Status: Abandoned Application

• Current Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Original Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Inventors: Chen, Yu-Chih, Leung, Chi Kuen, Leung, Lap-Wai Lydia, Lin, Jyh-Rong, Chung, Chang Hwa
• Application Number:
  US11/934,007
• Publication Number:
  US 20090115051A1
• Time in Patent Office: Days
• US Class Current: 257/701
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19015 including thin film passive components
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component

Abstract

An electronic circuit package has a thin-film circuit integrated with the ceramic substrate. The thin-film circuit includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active power electronic component mounted on the ceramic substrate and is electrically connected with the integrated thin-film circuit.

Claims

1. An electronic circuit package comprising:

a ceramic substrate,

a thin-film circuit integrated with the ceramic substrate, the thin-film circuit comprising at least two passive circuit elements joined by an electrical interconnect, and

at least one active power electronic component mounted on the ceramic substrate and electrically connected with the integrated thin-film circuit.

2. The package of claim 1 wherein the thin-film circuit is integrated with the ceramic substrate by a method selected from a group comprising metal and dielectric deposition, electroplating and etching.

3. The package of claim 1 wherein the active electronic component is mounted to the ceramic substrate without any dielectric material between the active electronic component and the ceramic substrate.

4. The package of claim 3 wherein active electronic component is mounted on the die bond pad with adhesive which could be conductive or non-conductive.

5. The package of claim 1 wherein the thin-film circuit is integrated with the ceramic substrate.

6. The package of claim 1 wherein the passive circuit elements are selected from the group consisting of a resistor, a capacitor, an inductor, a through hole, a via and a wrap-around.

7. The package of claim 1 wherein the thin-film circuit is selected from a group consisting of an LC matching network, a low-pass filter, a band-pass filter, a high-pass filter, a diplexer and a balun.

8. The package of claim 1 wherein the active electronic component comprises a semiconductor chip device or packaged IC.

9. The package of claim 8 wherein the semiconductor chip device is selected from a group consisting of a RF die, a low-noise amplifier, a power amplifier and a switch.

10. An electronic circuit package comprising:

a ceramic substrate,

a thin-film circuit integrated with the ceramic substrate, thin-film circuit comprising at least two passive circuit elements connected to a bond pad and wherein there is no dielectric layer between the bond pad and the substrate, and

an active electronic component mounted to the bond pad using a conductive or non conductive adhesive.