ANISOTROPIC CONDUCTIVE SHEET, ITS PRODUCTION METHOD, CONNECTION METHOD AND INSPECTION METHOD

• US 20090115444A1
• Filed: 11/08/2006
• Published: 05/07/2009
• Est. Priority Date: 11/21/2005
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Okuda, Yasuhiro, Fujita, Taro, Hosoe, Akihisa
• Granted Patent: US 7,667,480 B2
• Time in Patent Office: Days
• US Class Current: 324/762.10
• CPC Class Codes: H01R 11/01 characterised by the form or arrangement of the conductive interconnection between the connecting locations
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H01R 43/0235 for applying solder H01R43/0228 takes precedence
• CPC Class Codes: H01R 43/0249 for simultaneous welding or soldering of a plurality of wires to contact elements
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09527 Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

Provided is an anisotropic conductive sheet (8) having heat resistance and cold resistance and suitable for connection of electrodes. The anisotropic conductive sheet of the present invention has conductivity in the thickness direction, wherein the base film (1), which is a film made of synthetic resin having an electrical insulation property, has a plurality of holes (3) formed in the thickness direction, and the holes (3) are open to one main surface of the base film and closed to the other main surface, wherein a metal is adhered to the closed parts (2a) and the inner walls (2b) of the holes (3) so that by contacting electrodes (7) with the closed parts (2a) respectively from the outside, the electrodes (7) can electrically be connected through the adhered metal to the main surface where the holes (3) are open.

Claims

1. An anisotropic conductive sheet (8) having conductivity in the thickness direction, wherein the base film (1) is a film made of synthetic resin having an electrical insulation property and the base film has a plurality of holes (3) formed in the thickness direction, the holes (3) being open to one main surface of the base film and closed to the other main surface, wherein a metal is adhered to closed parts (2a) and inner walls (2b) of the holes 3 so that the main surface on the side where the holes are open is electrically connected through the metal to electrodes (7) by contacting the electrodes with the closed parts respectively from the outside.

2. An anisotropic conductive sheet according to claim 1, wherein the synthetic resin is an expanded polytetrafluoroethylene.

3. A production method of an anisotropic conductive sheet (8) as set forth in claim 1, wherein holes (3) are formed in the thickness direction by irradiating a laser beam or an X-ray of synchrotron radiation.

4. A production method of an anisotropic conductive sheet (8) as set forth in claim 1, wherein holes (3) are formed in the thickness direction by drilling.

5. A connection method characterized in that electrodes (7) of a semiconductor chip or a circuit board are connected to the closed parts (2a) of the holes of an anisotropic conductive sheet as set forth in claim 1.

6. An inspection method characterized in that in an electrical inspection of a semiconductor chip or circuit board, the inspection is done by contacting an electrode of an inspection article with the closed part of a hole of the anisotropic conductive sheet as set forth in claim 1.