MANUFACTURING METHOD FOR RFID TAG
First Claim
1. A manufacturing method for an RFID tag, comprising:
- an application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip to be placed;
a placement process in which the circuit chip is placed in the area where the adhesive is applied in the application process, and thereby the circuit chip is connected with the antennae;
a covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base; and
a heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.
1 Assignment
0 Petitions
Accused Products
Abstract
An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.
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Citations
17 Claims
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1. A manufacturing method for an RFID tag, comprising:
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an application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip to be placed; a placement process in which the circuit chip is placed in the area where the adhesive is applied in the application process, and thereby the circuit chip is connected with the antennae; a covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base; and a heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An RFID tag comprising:
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a predetermined base; antennae wired on the base; a circuit chip electrically connected to the antennae; a heat-curable adhesive fixing the circuit chip on the base, the adhesive having a quantity sufficient for the adhesive to be applied all the way to a position equal to or exceeding a height of the circuit chip; and a sheet member having an adhesive layer on a surface thereof, fixed to the base and covering the circuit chip such that the adhesive layer faces the base. - View Dependent Claims (11, 12)
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13. A manufacturing method for an RFID tag, comprising:
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an application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip to be placed, a quantity of adhesive being sufficient for the adhesive to be applied to a position equal to or exceeding the height of the circuit chip when the chip is placed on the base; a placement process in which the circuit chip is placed in an area where the adhesive is applied in the application process, and thereby the circuit chip is connected with the antennae; a covering process in which the circuit chip placed on the base is covered with a sheet that is not susceptible to the adhesive; a heat and pressure applying process in which pressure is applied to the sheet toward the base, and heat and pressure are applied to the circuit chip from above the sheet, thereby curing the adhesive and fixing the circuit chip on the base; and a peeling process in which the sheet is peeled off from the adhesive cured in the heat and pressure applying process. - View Dependent Claims (14, 15)
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16. An RFID tag comprising:
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a predetermined base; antennae wired on the base; a circuit chip electrically connected to the antennae; and a heat-curable adhesive fixing the circuit chip on the base, the adhesive having a quantity sufficient for the adhesive to be applied to a position equal to or exceeding a height of the circuit chip. - View Dependent Claims (17)
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Specification