Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
First Claim
1. A method of manufacturing a semiconductor device, the method comprising:
- providing a substrate;
forming a penetrating hole in the substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface of the substrate and an internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface of the substrate;
forming a conductive member on the first surface of the substrate so that the conductive member covers the penetrating hole;
mounting a semiconductor chip on the first surface of the substrate so that an electrode of the semiconductor chip is electrically connected to the conductive member; and
providing an external electrode through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of manufacturing a semiconductor device forms a penetrating hole in a substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface. An internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface. A conductive member is formed on the first surface so that the conductive member covers the penetrating hole. A semiconductor chip is mounted on the first surface so that an electrode of the semiconductor chip is electrically connected to the conductive member. An external electrode is provided through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate.
-
Citations
12 Claims
-
1. A method of manufacturing a semiconductor device, the method comprising:
-
providing a substrate; forming a penetrating hole in the substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface of the substrate and an internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface of the substrate; forming a conductive member on the first surface of the substrate so that the conductive member covers the penetrating hole; mounting a semiconductor chip on the first surface of the substrate so that an electrode of the semiconductor chip is electrically connected to the conductive member; and providing an external electrode through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method of manufacturing a semiconductor device, the method comprising:
-
providing a substrate; forming a penetrating hole in the substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface of the substrate and an internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface of the substrate; forming a conductive member on the first surface of the substrate so that the conductive member covers the penetrating hole; mounting a semiconductor chip on the first surface of the substrate so that an electrode of the semiconductor chip is electrically connected to the conductive member; and providing a conductive material in the penetrating hole so that the conductive material is electrically connected to the conductive member and the conductive material is in contact with a first part of a surface of the protrusion facing a second opening of the penetrating hole in the second surface of the substrate. - View Dependent Claims (11, 12)
-
Specification