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Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

  • US 20090117687A1
  • Filed: 12/04/2008
  • Published: 05/07/2009
  • Est. Priority Date: 03/27/1998
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device, the method comprising:

  • providing a substrate;

    forming a penetrating hole in the substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface of the substrate and an internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface of the substrate;

    forming a conductive member on the first surface of the substrate so that the conductive member covers the penetrating hole;

    mounting a semiconductor chip on the first surface of the substrate so that an electrode of the semiconductor chip is electrically connected to the conductive member; and

    providing an external electrode through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate.

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