RADIO FREQUENCY IDENTIFICATION DEVICE SUPPORT FOR PASSPORT AND ITS MANUFACTURING METHOD

• US 20090120564A1
• Filed: 10/13/2008
• Published: 05/14/2009
• Est. Priority Date: 10/11/2007
• Status: Active Grant

• Current Assignee: Ask S.A. (Paragon Group Limited)
• Original Assignee: Ask S.A. (Paragon Group Limited)
• Inventors: Mazabaud, Olivier, HALOPE, Christophe
• Granted Patent: US 8,038,831 B2
• Time in Patent Office: Days
• US Class Current: 156/219
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/1039 Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2804 Next to metal

Abstract

A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps:

• • producing an antenna (12) having contacts (13 and 14) on a support (10),
  • creating a recess (20) between the contacts (13 and 14),
  • placing adhesive dielectric material (25, 26) near the contacts of the antenna,
  • positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20),
  • placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60),
  • placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film,
  • laminating all the layers.

Claims

1-10. -10. (canceled)

11. A method for manufacturing an identity booklet cover provided with a radio frequency identification device (RFID), said device featuring an antenna and a chip connected to the antenna, said method comprising:

producing an antenna having contacts on a support made of paper or synthetic paper,

creating a recess between the contacts of the antenna,

placing adhesive dielectric material on the antenna support near said antenna contacts,

positioning an integrated circuit module on said support, said module featuring groups of contacts and the chip connected to groups of contacts inside an encapsulation of the module, so that the groups of contacts of said module are opposite said contacts of said antenna and the module is encapsulated into the recess,

placing on the face of said support featuring the antenna at least one layer of thermo-adhesive film,

placing a cover layer on the layer (or) layer(s) of thermo-adhesive film,

laminating together the support layer, the layer (or) layer(s) of thermo-adhesive film and the cover layer.

12. The method of claim 11, wherein a step preliminary to the manufacturing step of the antenna consists in embossing on a thickness between 50 and 60 μ

m a portion of said support layer at the location of the module, the embossing thus created being of a shape slightly larger than the module.

13. The method of claim 11, wherein the layer of thermo-adhesive film directly applied on the antenna support is provided with a recess at the location of the module, the shape of the recess is such that it matches the edges of the lower face of the module.

14. The method of claim 11, wherein the adhesive material applied to the antenna support layer is a cyanoacrylate glue.

15. The method of claim 11, wherein said antenna contacts have a concave or hollow shape or else are hollowed out like a ring so that the contacts of adhesive material are placed inside the hollow of the concave shape or inside the opening.

16. The method of claim 11, wherein said antenna contacts are U-shaped and the adhesive dielectric material is placed inside the U.

17. The method of claim 11, wherein the synthetic paper of said support is made of a material that does not creep i.e. which does not deform when the temperature increases.

18. The method of claim 11, wherein said layers of thermo-adhesive film have a thickness of 50 μ

m.

19. The method of claim 11, wherein said antenna is made by screen printing using conductive ink.

20. A device obtained by the method of claim 11.