Substrate lamination system and method

• US 20090120572A1
• Filed: 01/18/2008
• Published: 05/14/2009
• Est. Priority Date: 08/30/2005
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Original Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Inventors: Barnidge, Tracy J., Nemeth, Paul R., Sampica, James D., Marzen, Vincent P.
• Granted Patent: US 8,691,043 B2
• Time in Patent Office: Days
• US Class Current: 156/285
• CPC Class Codes: B32B 2038/1891 Using a robot for handling the layers
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/04 Time
• CPC Class Codes: B32B 2309/72 For measuring or regulating, e.g. systems with feedback loops
• CPC Class Codes: B32B 2315/08 Glass
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 37/003 to avoid air inclusion
• CPC Class Codes: B32B 37/0046 characterised by constructional aspects of the apparatus
• CPC Class Codes: B32B 37/1018 using only vacuum
• CPC Class Codes: B32B 37/12 characterised by using adhesives

Abstract

The present disclosure is directed to a substrate lamination system and method.

A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate.

A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first substrate and the second substrate

Claims

1. A process for laminating substrates, the process comprising the steps:

disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate;

disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber;

evacuating the vacuum chamber;

applying pressure to at least one of the first substrate and the second substrate.

2. The process of claim 1, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

disposing a sheet of pressure-sensitive adhesive between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate.

3. The process of claim 1, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

coating at least one of the substantially planar surface of the first substrate or the substantially planar surface of the second substrate with a pressure-sensitive adhesive.

4. The process of claim 1, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

co-aligning a portion of the first substrate with a portion of the second substrate.

5. The process of claim 1, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer.

6. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a support pin.

7. The process of claim 6, wherein the supporting at least one of the first substrate and the second substrate on a support pin further comprises:

supporting the at least one of the first substrate and the second substrate on a retractable support pin.

8. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a deformable support.

9. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on an electromagnetic support.

10. The process of claim 1, wherein the evacuating the vacuum chamber further comprises:

evacuating a first portion of the vacuum chamber to a first pressure.

11. The process of claim 10, wherein the evacuating the vacuum chamber further comprises:

evacuating a second portion of the vacuum chamber to a second pressure.

12. The process of claim 1, wherein the applying pressure to at least one of the first substrate and the second substrate further comprises:

expanding a flexible member by the application of pressure to a surface of the flexible membrane.

13. The process of claim 12, wherein the expanding a flexible member by the application of pressure to a surface of the flexible membrane further comprises:

expanding a flexible member by the application of air pressure to a surface of the flexible membrane.

14. The process of claim 12, further comprising:

masking a portion of at least one of the first substrate and second substrate from contact with the flexible membrane.

15. The process of claim 1, further comprising:

contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer.

16. The process of claim 15, wherein the contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer further comprises:

retracting a support pin.

17. The process of claim 1, further comprising:

heating at least one of the first substrate, pressure-sensitive adhesive layer, and second substrate.

18. The process of claim 17, further comprising:

pressurizing an environment containing the first substrate, pressure-sensitive adhesive layer, and second substrate.

19. A system for laminating of substrates, the system comprising:

means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate;

means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber;

means for evacuating the vacuum chamber;

means for applying pressure to at least one of the first substrate and the second substrate.

20. The system of claim 19, wherein the means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

means for disposing a sheet of pressure-sensitive adhesive between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate.

21. The system of claim 19, wherein the means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

means for coating at least one of the substantially planar surface of the first substrate or the substantially planar surface of the second substrate with a pressure-sensitive adhesive.

22. The system of claim 19, wherein the means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

means for co-aligning a portion of the first substrate with a portion of the second substrate.

23. The system of claim 19, wherein the means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

means for maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer.

24. The system of claim 23, wherein the means for maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

means for supporting at least one of the first substrate and the second substrate on a support pin.

25. The system of claim 24, wherein the means for supporting at least one of the first substrate and the second substrate on a support pin further comprises:

means for supporting the at least one of the first substrate and the second substrate on a retractable support pin.

26. The system of claim 23, wherein the means for maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

means for supporting at least one of the first substrate and the second substrate on a deformable support.

27. The system of claim 23, wherein the means for maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

means for supporting at least one of the first substrate and the second substrate on an electromagnetic support.

28. The system of claim 19, wherein the means for evacuating the vacuum chamber further comprises:

means for evacuating a first portion of the vacuum chamber to a first pressure.

29. The system of claim 28, wherein the means for evacuating the vacuum chamber further comprises:

means for evacuating a second portion of the vacuum chamber to a second pressure.

30. The system of claim 19, wherein the means for applying pressure to at least one of the first substrate and the second substrate further comprises:

means for expanding a flexible member by the application of pressure to a surface of the flexible membrane.

31. The system of claim 30, wherein the means for expanding a flexible member by the application of pressure to a surface of the flexible membrane further comprises:

means for expanding a flexible member by the application of air pressure to a surface of the flexible membrane.

32. The system of claim 30, further comprising:

means for masking a portion of at least one of the first substrate and second substrate from contact with the flexible membrane.

33. The system of claim 19, further comprising:

means for contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer.

34. The system of claim 33, wherein the means for contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer further comprises:

means for retracting a support pin.

35. The system of claim 19, further comprising:

means for heating at least one of the first substrate, pressure-sensitive adhesive layer, and second substrate.

36. The system of claim 35, further comprising:

means for pressurizing an environment containing the first substrate, pressure-sensitive adhesive layer, and second substrate.

37. A computer-readable medium comprising computer readable instructions for execution of a process by a computer, the process comprising the steps:

disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate;

disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber;

evacuating the vacuum chamber;

applying pressure to at least one of the first substrate and the second substrate.

38. The computer-readable medium of claim 37, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

disposing a sheet of pressure-sensitive adhesive between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate.

39. The computer-readable medium of claim 37, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

coating at least one of the substantially planar surface of the first substrate or the substantially planar surface of the second substrate with a pressure-sensitive adhesive.

40. The computer-readable medium of claim 37, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

co-aligning a portion of the first substrate with a portion of the second substrate.

41. The computer-readable medium of claim 37, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer.

42. The computer-readable medium of claim 41, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a support pin.

43. The computer-readable medium of claim 42, wherein the supporting at least one of the first substrate and the second substrate on a support pin further comprises:

supporting the at least one of the first substrate and the second substrate on a retractable support pin.

44. The computer-readable medium of claim 41, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a deformable support.

45. The computer-readable medium of claim 41, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on an electromagnetic support.

46. The computer-readable medium of claim 37, wherein the evacuating the vacuum chamber further comprises:

evacuating a first portion of the vacuum chamber to a first pressure.

47. The computer-readable medium of claim 46, wherein the evacuating the vacuum chamber further comprises:

evacuating a second portion of the vacuum chamber to a second pressure.

48. The computer-readable medium of claim 37, wherein the applying pressure to at least one of the first substrate and the second substrate further comprises:

expanding a flexible member by the application of pressure to a surface of the flexible membrane.

49. The computer-readable medium of claim 48, wherein the expanding a flexible member by the application of pressure to a surface of the flexible membrane further comprises:

expanding a flexible member by the application of air pressure to a surface of the flexible membrane.

50. The computer-readable medium of claim 48, further comprising instructions for:

masking a portion of at least one of the first substrate and second substrate from contact with the flexible membrane.

51. The computer-readable medium of claim 37, further comprising instructions for:

contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer.

52. The computer-readable medium of claim 51, wherein the contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer further comprises:

retracting a support pin.

53. The computer-readable medium of claim 37, further comprising instructions for:

heating at least one of the first substrate, pressure-sensitive adhesive layer, and second substrate.

54. The computer-readable medium of claim 53, further comprising instructions for:

pressurizing an environment containing the first substrate, pressure-sensitive adhesive layer, and second substrate.