Substrate lamination system and method

• US 20090120585A1
• Filed: 01/18/2008
• Published: 05/14/2009
• Est. Priority Date: 08/30/2005
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Original Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Inventors: Barnidge, Tracy J., Nemeth, Paul R., Sampica, James D., Marzen, Vincent P.
• Granted Patent: US 8,936,057 B2
• Time in Patent Office: Days
• US Class Current: 156/382
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 37/003 to avoid air inclusion
• CPC Class Codes: B32B 37/0046 characterised by constructional aspects of the apparatus
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 37/1009 using vacuum and fluid pressure
• CPC Class Codes: B32B 38/1841 during laying up

Abstract

The present disclosure is directed to a substrate lamination system and method.

A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support.

A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.

Claims

1. A substrate lamination apparatus, the apparatus comprising:

a vacuum chamber;

a flexible membrane, the flexible membrane partitioning the vacuum chamber into a first compartment and a second compartment; and

a substrate support.

2. The apparatus of claim 1, further comprising:

a first port disposed in a wall portion of the first compartment; and

a second port disposed in a wall portion of the second compartment.

3. The apparatus of claim 1, wherein the flexible membrane further comprises:

a silicone rubber membrane,

4. The apparatus of claim 1, wherein the flexible membrane has an elongation capacity of at least 100%.

5. The apparatus of claim 1, wherein the flexible membrane has a tear strength of at least 30 psi.

6. The apparatus of claim 1, wherein the substrate support further comprises:

a retractable support pin.

7. The apparatus of claim 1, wherein the substrate support further comprises:

a retractable support pin;

an actuating mechanism.

8. The apparatus of claim 1, wherein the substrate support further comprises:

a deformable support.

9. The apparatus of claim 1, wherein the substrate support further comprises:

an electromagnetic support.

10. The apparatus of claim 1, further comprising:

a substrate alignment insert.

11. The apparatus of claim 10, wherein the substrate alignment insert further comprises:

a base portion; and

at least one substrate alignment guide.

12. The apparatus of claim 1, further comprising:

a substrate mask.

13. The apparatus of claim 12, wherein the substrate mask further comprises:

a mask aperture.

14. The apparatus of claim 1, wherein the vacuum chamber further comprises:

a lid structure.

15. The apparatus of claim 14, wherein the vacuum chamber further comprises:

a lid positioning mechanism.

16. The apparatus of claim 14, wherein the vacuum chamber further comprises:

a locking mechanism.

17. The apparatus of claim 16, wherein the locking mechanism further comprises:

an electromagnetic locking mechanism.

18. A substrate lamination system, the apparatus comprising:

a vacuum chamber;

a flexible membrane, the flexible membrane partitioning the vacuum chamber into a first compartment and a second compartment;

a substrate support;

a vacuum pump;

a compressor; and

a control unit.

wherein the control unit is configured to carry out the steps;

evacuating the vacuum chamber;

applying pressure to at least one of a first substrate and a second substrate.

19. The system of claim 18, wherein the control unit is configured to carry out the step:

disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate.

20. The system of claim 19, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

disposing a sheet of pressure-sensitive adhesive between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate.

21. The system of claim 19, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

coating at least a portion of at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate with a pressure-sensitive adhesive.

22. The system of claim 18, wherein the control unit is configured to carry out the step:

disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber.

23. The system of claim 22, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

co-aligning a portion of the first substrate with a portion of the second substrate.

24. The system of claim 22, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer.

25. The system of claim 24, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a support pin.

26. The system of claim 25, wherein the supporting at least one of the first substrate and the second substrate on a support pin further comprises:

supporting the at least one of the first substrate and the second substrate on a retractable support pin.

27. The system of claim 24, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate a deformable support.

28. The system of claim 24, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on at least one electromagnetic support.

29. The system of claim 18, wherein the evacuating the vacuum chamber further comprises:

evacuating a first portion of the vacuum chamber to a first pressure.

30. The system of claim 29, wherein the evacuating the vacuum chamber further comprises:

evacuating a second portion of the vacuum chamber to a second pressure.

31. The system of claim 18, wherein the applying pressure to at least one of a first substrate and a second substrate further comprises:

expanding a flexible membrane by the application of pressure to a surface of the flexible membrane.

32. The system of claim 31, wherein the expanding a flexible membrane by the application of pressure to a surface of the flexible membrane further comprises:

expanding a flexible membrane by the application of air pressure to a surface of the flexible membrane.

33. The system of claim 31, wherein the control unit is configured to carry out the step:

masking a portion of at least one of the first substrate and second substrate from contact with the flexible membrane.

34. The system of claim 18, wherein the control unit is configured to carry out the step:

contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer.

35. The system of claim 34, wherein the contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer further comprising:

retracting a support pin.

36. The system of claim 18, wherein the control unit is configured to carry out the step:

heating at least one of the first substrate, pressure-sensitive adhesive layer, and second substrate.

37. The system of claim 18, wherein the control unit is configured to carry out the step:

pressurizing an environment containing the first substrate, pressure-sensitive adhesive layer, and second substrate.