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DISPOSABLE BUILT-IN SELF-TEST DEVICES, SYSTEMS AND METHODS FOR TESTING THREE DIMENSIONAL INTEGRATED CIRCUITS

  • US 20090121736A1
  • Filed: 11/13/2007
  • Published: 05/14/2009
  • Est. Priority Date: 11/13/2007
  • Status: Active Grant
First Claim
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1. A method for self-testing an integrated circuit layer for a three-dimensional integrated circuit, comprising:

  • integrally forming a disposable self-test circuit on a common substrate with a first circuit to be tested, the first circuit for forming a layer in a three-dimensional integrated circuit structure;

    testing the first circuit using circuitry of the self-test circuit; and

    removing the self-test circuit by detaching the self-test circuit from the first circuit.

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