LED MODULE FOR ILLUMINATION

• US 20090122514A1
• Filed: 03/13/2007
• Published: 05/14/2009
• Est. Priority Date: 03/17/2006
• Status: Active Grant

• Current Assignee: Weon Kim
• Original Assignee: Dae Shin Led Co., Ltd.
• Inventors: Kang, Woo Suk, Yoon, Young Ro
• Granted Patent: US 7,740,373 B2
• Time in Patent Office: Days
• US Class Current: 362/84
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.

Claims

1. An LED module used for illumination, comprising:

a heat radiation substrate including an insulation substrate having an electrode pattern formed thereon and a radiator integrally bonded to a lower portion of the insulation substrate;

a plurality of LED elements mounted on the heat radiation substrate;

a case having a hollow portion formed therein, the hollow portion passing through top and bottom surface of the case, the heat radiation substrate being attached to the bottom surface of the case, thereby allowing the LED elements to be positioned in an interior of the hollow portion; and

a lens provided on the case,

wherein a lower light emitting film made of a transparent material, a phosphor film containing a phosphor and an upper light emitting film made of a transparent material are sequentially coated on a top surface of the heat radiation substrate positioned in the interior of the hollow portion.

2. The LED module as claimed in claim 1, wherein the case has a lens groove formed on a top surface thereof, and the lens is seated in the lens groove.

3. The LED module as claimed in claim 1, wherein the LED elements are attached on the electrode pattern.

4. The LED module as claimed in claim 3, wherein the LED elements are bonded using silver epoxy as an adhesive agent.

5. The LED module as claimed in claim 1, wherein the electrode pattern is formed in a matrix form in which serial and parallel structures are mixed.

6. The LED module as claimed in claim 1, wherein the hollow portion of the case is formed in the shape of a rectangle.

7. The LED module as claimed in claim 1, wherein the lower light emitting film is made of clear silicon.

8. The LED module as claimed in claim 7, wherein the lower light emitting film is coated to completely surround the LED elements.

9. The LED module as claimed in claim 1, wherein the lower light emitting film is made of epoxy resin containing Al₂O₃.

10. The LED module as claimed in claim 9, wherein the lower light emitting film is coated to completely surround side surfaces of the LED elements.

11. The LED module as claimed in claim 1, wherein the heat radiation substrate has two or more mounting holes passing through top and bottom thereof, and the case has fixing pins respectively formed at positions corresponding to the mounting holes of the heat radiation substrate to be inserted into the mounting holes.

12. The LED module as claimed in claim 1, wherein the insulation substrate is formed to have a thickness of 35 μ

m or less.

13. The LED module as claimed in claim 1, wherein the upper light emitting film is made of clear silicon.

14. The LED module as claimed in claim 1, wherein the upper light emitting film is formed so that a space between a top surface of the phosphor film and a bottom surface of the lens is completely filled with the upper light emitting film.

15. The LED module as claimed in claim 1, wherein the case has a circular lens groove formed on the top surface thereof, and the lens is a plane lens formed to have a flat top surface by filling the lens groove with the lens.