Configuration and Method for the Manufacture of a Failsafe LED or OLED Chain

• US 20090122535A1
• Filed: 11/30/2007
• Published: 05/14/2009
• Est. Priority Date: 11/30/2006
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Niedermeier, Peter
• Granted Patent: US 7,635,954 B2
• Time in Patent Office: Days
• US Class Current: 362/234
• CPC Class Codes: H05B 45/54 in a series array of LEDs
• CPC Class Codes: H05B 47/23 of two or more light sources connected in series
• CPC Class Codes: H10K 59/86 Series electrical configurations of multiple OLEDs
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A structural configuration of a failsafe OLED chain with multiple OLED lighting components in series connection is described. During the manufacture of the lighting component a weak spot is specifically installed at an appropriate location of the structure in the form of a break-through layer, which in the event of a failure of the lighting component breaks down and bypasses the component with a bypass layer.

Claims

1. A light emitting device including a series of light emitting components, comprising:

a first light component defined in part by a conductive layer;

a second light component defined in part by a conductive layer;

a conducting bypass layer; and

a break-through layer insulating the conducting bypass layer from the conductive layer of the first light component;

wherein the break-through layer is configured so that in the event of a failure of the first lighting component, the break-through layer breaks down and allows the conducting bypass layer to electrically connect the conductive layer of the first light component to the conductive layer of the second light component.

2. The device of claim 1, wherein the conductive layer of the first light component is a cathode.

3. The device of claim 1, wherein a thickness of the break-through layer is such that the break-through layer is capable of reliably insulating a voltage of at least the level of the forward voltage of the lighting component.

4. The device of claim 1, wherein the thickness of the break-through layer is such that at a voltage level equal to a multiple of the forward voltage of the LED or OLED component, the break-through layer reliable breaks down.

5. The device of claim 1, wherein the break-through layer includes an oxide layer.

6. The device of claim 1, wherein the first light component is a light emitting diode.

7. The device of claim 1, wherein the first light component is an organic light emitting diode.

8. A method for manufacturing a light emitting device including a series of light emitting components, comprising:

forming a first light component defined in part by a conductive layer and a second light component defined in part by a conductive layer;

depositing an insulating break-through layer onto the conductive layer of the first light component; and

depositing a conductive bypass layer onto the break-through layer and adjacent to the second light component.

9. The method of claim 8, wherein the conductive layer is a cathode.

10. The method of claim 8, wherein the break-through layer includes an oxide layer.

11. The method of claim 8, wherein forming the first light component includes forming a light emitting diode.

12. The method of claim 8, wherein forming the first light component includes forming an organic light emitting diode.