LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF, LIGHT-EMITTING ELEMENT MODULE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE, LIGHTING DEVICE, AND TRAFFIC LIGHT

• US 20090122554A1
• Filed: 11/28/2008
• Published: 05/14/2009
• Est. Priority Date: 11/19/2004
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Ito, Masanori, Ohashi, Masakazu, Uruga, Ken-ichi
• Granted Patent: US 7,866,853 B2
• Time in Patent Office: Days
• US Class Current: 362/296.10
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The present invention provides a light-emitting element mounting substrate which includes: a core metal provided with a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction, and an enamel layer having a thickness within a range of 50 μm to 200 μm, and provided on a surface of the core metal. The present invention also provides a light-emitting element module in which a light-emitting element is provided on this light-emitting element mounting substrate, and in which the light-emitting element is sealed with a transparent sealing resin.

Claims

1. A light-emitting element mounting substrate comprising:

a core metal provided with a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction; and

an enamel layer having a thickness within a range of 50 μ

m to 200 μ

m, and provided on a surface of the core metal.

2. The light-emitting element mounting substrate according to claim 1, wherein a groove is provided at a circumferential edge of a bottom part of the reflective cup.

3. A light-emitting element module which mounts a light-emitting element on the light-emitting element mounting substrate according to claim 1 or 2, wherein the light-emitting element is sealed with transparent sealing resin.

4. The light-emitting module according to claim 3, wherein the light-emitting element is a white light-emitting diode that is formed by mixing fluorescent material into the sealing resin, and emits white light.

10. A display device comprising the light-emitting element module according to claim 3.

11. A lighting device comprising the light-emitting element module according to claim 4.

12. A traffic light comprising the light-emitting element module according to claim 3

5. A method of manufacturing a light-emitting element mounting substrate, the method comprising:

forming a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction, at a predetermined position on a core metal; and

subsequently applying and baking enamel material on a surface of the core metal, to form an enamel layer which has a thickness within a range of 50 μ

m to 200 μ

m on the surface of the core metal.

6. The method of manufacturing a light-emitting element mounting substrate according to claim 5, wherein enamel material whose primary component is glass, is electro-deposited onto the surface of the core metal, and baking is subsequently conducted.

7. A method of manufacturing a light-emitting element module, the method comprising:

forming a light-emitting element mounting substrate by forming a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction, at a predetermined position on a core metal, and subsequently applying and baking enamel material on a surface of the core metal, to form an enamel layer which has a thickness within a range of 50 μ

m to 200 μ

m on the surface of the core metal;

subsequently forming electrodes on the surface of the light-emitting element mounting substrate;

subsequently mounting a light-emitting element onto the electrode at the center portion of the reflective cup so as to electrically connect the electrode and the light-emitting element; and

subsequently filling the reflective cup with resin and curing the resin to seal the light-emitting element.

8. The method of manufacturing a light-emitting element module according to claim 7, wherein the light-emitting element is sealed by resin which is intermixed with fluorescent material.

9. The method of manufacturing a light-emitting element module according to claim 8, wherein the light-emitting element is a blue light emitting diode, and the fluorescent material is a blue-excited yellow-emitting fluorescent material.