Electronic inlay structure and method of manufacture thereof

• US 20090123704A1
• Filed: 11/14/2007
• Published: 05/14/2009
• Est. Priority Date: 11/14/2007
• Status: Active Grant

• Current Assignee: Linxens Holding SAS
• Original Assignee: Smartrac IP BV (OEP Technologie BV)
• Inventors: Bashan, Oded, Shafran, Guy
• Granted Patent: US 8,028,923 B2
• Time in Patent Office: Days
• US Class Current: 428/167
• CPC Class Codes: B29C 65/02 by heating, with or without pressure
• CPC Class Codes: B29C 65/4815 Hot melt adhesives, e.g. thermoplastic adhesives
• CPC Class Codes: B29C 65/5042 covering both elements to be joined
• CPC Class Codes: B29C 65/7802 Positioning the parts to be joined, e.g. aligning, indexing or centring
• CPC Class Codes: B29C 65/7808 in the form of holes or slots B29C65/7814 takes precedence; holding or clamping means cooperating with specially formed features of at least one of the parts to be joined B29C65/7844
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/1142 Single butt to butt joints
• CPC Class Codes: B29C 66/21 said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
• CPC Class Codes: B29C 66/43 Joining a relatively small portion of the surface of said articles B29C66/45 takes precedence
• CPC Class Codes: B29C 66/433 Casing-in, i.e. enclosing an element between two sheets by an outlined seam for bookbinding B42C11/06; for packaging B65B; by laminating B32B37/00; enclosing tubular articles between substantially flat elements B29C66/53261
• CPC Class Codes: B29C 66/45 Joining of substantially the whole surface of the articles methods or apparatus for laminating B32B37/00
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29C 66/72328 Paper
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: B29K 2027/06 PVC, i.e. polyvinylchloride
• CPC Class Codes: B29K 2055/02 ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
• CPC Class Codes: B29K 2067/00 Use of polyesters or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2067/003 PET, i.e. poylethylene terephthalate
• CPC Class Codes: B29K 2067/043 PGA, i.e. polyglycolic acid or polyglycolide
• CPC Class Codes: B29K 2069/00 Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2711/123 : Coated
• CPC Class Codes: B29L 2017/00 : Carriers for sound or information
• CPC Class Codes: G06K 19/025 : the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs methods for testing the genuineness of valuable papers, e.g. banknotes or passports G07D7/00; constructional features of booklets and the like B42D
• CPC Class Codes: Y10T 428/2457 : Parallel ribs and/or grooves

Abstract

An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure.

Claims

1. An electronic inlay structure comprising:

first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween;

a flexible web material arranged to overlie said gap and edges of said first and second sheets of said inlay structure adjacent said gap;

third and fourth sheets arranged in registration with said first and second sheets respectively, over said first and second sheets of said inlay substrate and partially over said flexible web material and bonded thereto;

electronic circuitry associated with at least one of said first, second, third and fourth sheets; and

lamination enclosing said first, second, third and fourth sheets, said electronic circuitry and said web material together to create said inlay structure.

2. An electronic inlay structure according to claim 1 and wherein said inlay substrate material is selected from the group consisting of coated paper, TESLIN®

, PVC, polycarbonate, PET-G, PETF and ABS.

3. An electronic inlay structure according to claim 1 and wherein at least part of said electronic circuitry is located on any of said first, second, third and fourth sheets of said inlay substrate.

4. An electronic inlay structure according to claim 3 and wherein said electronic circuitry comprises at least one wireless communication antenna which is at least partially embedded in at least one of said first, second, third and fourth sheets.

5. An electronic inlay structure according to claim 1 and wherein said electronic circuitry comprises at least one wireless communication antenna which is at least partially embedded in at least one of said first, second, third and fourth sheets.

6. An electronic inlay structure according to claim 1 and wherein said electronic circuitry comprises a smart card chip providing identification functionality.

7. A method of manufacture of an electronic inlay structure, the method comprising:

arranging first and second sheets of an inlay substrate in generally side to side, spaced parallel arrangement, having a gap therebetween;

arranging a flexible web material to overlie said gap and edges of said first and second sheets of said inlay structure adjacent said gap;

arranging third and fourth sheets of an inlay substrate in registration with said first and second sheets respectively, over said first and second sheets of said inlay substrate and partially over said flexible web material;

bonding said first and third sheets together at locations where they overlie said flexible web material;

bonding said second and fourth sheets together at locations where they overlie said flexible web material;

associating electronic identification circuitry with at least one of said first, second, third and forth sheets; and

laminating said first, second, third and fourth sheets, said electronic circuitry and said web material together to create said inlay structure.

8. A method of manufacture according to claim 7 and wherein said inlay substrate material is selected from the group consisting of coated paper, TESLIN®

, PVC, polycarbonate, PET-G, PETF and ABS.