INTEGRATED CIRCUIT WITH INTRA-CHIP CLOCK INTERFACE AND METHODS FOR USE THEREWITH
First Claim
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1. An integrated circuit comprising:
- a substrate;
a first integrated circuit die coupled to the substrate, the first integrated circuit die including;
a first circuit;
a first intra-chip clock interface coupled to the substrate that transmits a first clock signal;
a second integrated circuit die coupled to the substrate, the second integrated circuit die including;
a second circuit that operates based on the first clock signal;
a second intra-chip clock interface coupled to the substrate that recovers the first clock signal;
wherein the substrate includes wave guide for coupling the first clock signal from the first intra-chip clock interface to the second intra-chip clock interface as a radio frequency signal.
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Abstract
An integrated circuit includes a substrate. A first integrated circuit die includes a first circuit and a first intra-chip clock interface that transmits a first clock signal via the substrate. A second integrated circuit die includes a second circuit that operates based on the first clock signal and a second intra-chip clock interface that recovers the first clock signal from the substrate.
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Citations
18 Claims
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1. An integrated circuit comprising:
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a substrate; a first integrated circuit die coupled to the substrate, the first integrated circuit die including; a first circuit; a first intra-chip clock interface coupled to the substrate that transmits a first clock signal; a second integrated circuit die coupled to the substrate, the second integrated circuit die including; a second circuit that operates based on the first clock signal; a second intra-chip clock interface coupled to the substrate that recovers the first clock signal; wherein the substrate includes wave guide for coupling the first clock signal from the first intra-chip clock interface to the second intra-chip clock interface as a radio frequency signal. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated circuit comprising:
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a substrate; a first integrated circuit die coupled to the substrate, the first integrated circuit die including; a first circuit; a first intra-chip clock interface coupled to the substrate that transmits a first clock signal; a second integrated circuit die coupled to the substrate, the second integrated circuit die including; a second circuit that operates based on the first clock signal; a second intra-chip clock interface coupled to the substrate that recovers the first clock signal; wherein the substrate includes a magnetic path for inductively coupling the first clock signal from the first intra-chip clock interface to the second intra-chip clock interface. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
communicating a first clock signal having a millimeter wave fundamental frequency from a first circuit of a first integrated circuit die to a second circuit of a second integrated circuit via a substrate that supports the first integrated circuit die and the second integrated circuit die. - View Dependent Claims (16, 17, 18)
Specification