IN-LINE PACKAGE APPARATUSES AND METHODS

• US 20090127314A1
• Filed: 11/18/2008
• Published: 05/21/2009
• Est. Priority Date: 11/19/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Jong-Gi, KIM, Min-Ill, Lee, Kwang-Yong, Jeong, Ki-Kwon
• Granted Patent: US 8,796,597 B2
• Time in Patent Office: Days
• US Class Current: 228/6.200
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/002 Soldering by means of induction heating
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Claims

1. An in-line package apparatus, comprising:

a first treating unit to treat one or more processing objects;

a heating unit to heat the one or more processing objects so as to perform a reflow process of a solder ball of the processing objects treated in the first treating unit;

an input storage unit disposed between the first treating unit and the heating unit to store the processing objects treated in the first treating unit; and

a moving unit to transfer the processing objects stored in the input storage unit to the heating unit,

wherein the input storage unit comprises;

one or more magazines having slots formed therein to receive the processing objects to be stacked and separated from each other; and

an input port disposed to be adjacent to the first treating unit to support the magazine.

2. The in-line package apparatus of claim 1, wherein:

the heating unit comprises a heating member to heat at least one of the processing objects using an induction heating method; and

the heating member comprises a coil and a power supply to apply an alternating current to the coil.

3. The in-line package apparatus of claim 2, wherein the input storage unit further comprises an input stacker disposed between the input port and the heating unit and providing a plurality of spaces into which the magazines are received.

4. The in-line package apparatus of claim 3, wherein:

the input port comprises a supporting plate on which the magazine is put, the supporting plate being able to move up and down; and

the input storage unit further comprises a pusher which pushes the magazine placed on the supporting plate to a space provided to the input stacker, and a stacker moving member which horizontally and vertically moves the input stacker.

5. The in-line package apparatus of claim 3, wherein the moving unit comprises:

a pair of rails extending from positions proximate to the input stacker to positions past a region heated by the heating member, the rails separated from one another; and

a moving member to remove the processing objects stored in the magazine in the input stacker from the magazine, and to move the processing objects along the rails.

6. The in-line package apparatus of claim 5, wherein the rails respectively define a slot with a slit shape extending along a lengthwise direction of the rails, the slots in which edge regions of the processing objects are inserted.

7. The in-line package apparatus of claim 6, wherein the rails respectively define a plurality of slots with slit shapes, the slots vertically separated from one another.

8. The in-line package apparatus of claim 3, wherein the moving unit comprises:

a pair of rails extending from positions proximate to the input stacker to positions past a region heated by the heating member, the rails separated from one another; and

a moving member to move the magazine in the input stacker along the rails.

9. The in-line package apparatus of claim 8, wherein:

the magazine comprises guide protrusions projecting outward therefrom; and

the rails respectively define a slot with a slit shape along lengths of the rails, the guide protrusions inserting in the slots.

10. The in-line package apparatus of claim 8, wherein the magazine is of a non-metal material.

11. The in-line package apparatus of claim 5, wherein the moving member comprises:

a moving bar movably provided horizontally in the heating unit;

an inserting finger coupled to the moving bar to be capable of moving vertically with respect to the moving bar, to remove processing objects from within the magazine; and

a withdrawing finger coupled to the moving bar to be capable of moving vertically with respect to the moving bar and separated a predetermined distance from the inserting finger, to withdraw processing objects that have been heated from the heating unit.

12. The in-line package apparatus of claim 2, wherein:

the moving unit comprises a plurality of moving units uniformly arranged in a horizontal direction, each of the moving units comprises;

a pair of rails extending from positions proximate to the input stacker to positions past a region heated by the heating member, the rails separated from one another, and

a moving member to remove the processing objects stored in the magazine in the input stacker from the magazine, and to move the processing objects along the rails; and

the heating member is provided corresponding to the respective rails and in plural.

13. The in-line package apparatus of claim 2, wherein:

the moving unit comprises a plurality of moving units uniformly arranged in a horizontal direction, each of the moving units comprises;

a pair of rails extending from positions proximate to the input module to positions past a region heated by a heating member in the heating unit, the rails separated from one another, and

a moving member to remove the processing objects stored in the magazine in the input module from the magazine, and to move the processing objects along the rails; and

the heating member is disposed to intersect all the pairs of rails that are respectively provided in each of the moving units, to simultaneously heat a plurality of processing objects on the rails.

14. The in-line package apparatus of claim 2, wherein:

the moving unit comprises a plurality of moving units uniformly arranged in a horizontal direction, each of the moving units comprises;

a pair of rails extending from positions proximate to the input module to positions past a region heated by a heating member in the heating unit, the rails separated from one another, and

a moving member to remove the processing objects stored in the magazine in the input module from the magazine, and to move the processing objects along the rails; and

the heating member is provided to be capable of moving between a plurality of the pairs of rails.

15. The in-line package apparatus of claim 2, wherein the heating member further comprises a rotating member to rotate the coil or the processing object.

16. The in-line package apparatus of claim 15, wherein the rotating member rotates the coil or the processing object on planes that the coil or processing object is supplied.

17. The in-line package apparatus of claim 15, wherein the rotating member rotates the coil or the processing object, such that an angle between the coil and the processing member is varied.

18. The in-line package apparatus of claim 2, wherein the coil fixedly installed at an angle with respect to the processing object.

19. The in-line package apparatus of claim 2, further comprising:

an infrared camera to capture an image of the processing object heated by the heating member.

20. The in-line package apparatus of claim 2, further comprising:

a chamber which the rail and the heating member provide,

wherein the chamber is of a metal material for electromagnetic interference (EMI) shielding.

21. The in-line package apparatus of claim 3, wherein:

the first treating unit is provided in plurality and the input storage unit is provided in plurality corresponding to each of the first treating units; and

the input storage unit further comprises a divider that is disposed between the input stackers and the heating unit and moves magazines stored in the input stacker to the heating unit.

22. The in-line package apparatus of claim 2, wherein the first treating unit comprises a chip mounter unit to mount a semiconductor chip with a solder ball on a printed circuit board and the processing object is the printed circuit board on which the semiconductor chip is mounted.

23. The in-line package apparatus of claim 2, wherein the first treating unit comprises a ball attach unit to attach a solder ball to the semiconductor chip and the processing object is the semiconductor chip to which the solder ball is attached.

24. The in-line package apparatus of claim 23, wherein:

the first treating unit comprises a ball attach unit to attach a solder ball to the semiconductor chip and a plurality of the semiconductor chip is provided to the processing object,

the in-line package apparatus further comprises;

a singulation unit to separate individual semiconductor chips from the processing objects; and

an output storage unit disposed between the heating unit and the singulation unit to store the processing object heated in the heating unit.