×

IN-LINE PACKAGE APPARATUSES AND METHODS

  • US 20090127314A1
  • Filed: 11/18/2008
  • Published: 05/21/2009
  • Est. Priority Date: 11/19/2007
  • Status: Active Grant
First Claim
Patent Images

1. An in-line package apparatus, comprising:

  • a first treating unit to treat one or more processing objects;

    a heating unit to heat the one or more processing objects so as to perform a reflow process of a solder ball of the processing objects treated in the first treating unit;

    an input storage unit disposed between the first treating unit and the heating unit to store the processing objects treated in the first treating unit; and

    a moving unit to transfer the processing objects stored in the input storage unit to the heating unit,wherein the input storage unit comprises;

    one or more magazines having slots formed therein to receive the processing objects to be stacked and separated from each other; and

    an input port disposed to be adjacent to the first treating unit to support the magazine.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×