LED CHIP THERMAL MANAGEMENT AND FABRICATION METHODS
First Claim
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1. A method for fabricating a thermal expansion coefficient matching substrate for a high power light-emitting device wherein said substrate comprises a metal composite material.
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Abstract
The present invention relates to a method of fabricating a high power light-emitting device using an electrolessly or electrolytically plated metal composite heat dissipation substrate having a high thermal conductivity and a thermal expansion coefficient matching with the device.
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18 Claims
- 1. A method for fabricating a thermal expansion coefficient matching substrate for a high power light-emitting device wherein said substrate comprises a metal composite material.
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18. A high power light-emitting device having a metal composite substrate, the substrate comprising a high thermal conductivity and thermal expansion coefficient matching substrate.
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