SEMICONDUCTOR APPARATUS

• US 20090127639A1
• Filed: 09/08/2008
• Published: 05/21/2009
• Est. Priority Date: 09/21/2007
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Suzuki, Kazuhiro, Iida, Yoshinori, Funaki, Hideyuki
• Application Number:
  US12/206,101
• Publication Number:
  US 20090127639A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis

Abstract

A semiconductor apparatus includes: a first chip including a MEMS device which has a structure supported in midair therein, and having first pads and a first joining region electrically connected to the MEMS device on a top face thereof; a second chip including a circuit having a semiconductor device electrically connected to the MEMS device therein, and having second pads and a second joining region electrically connected to the semiconductor device on a top face thereof, the second chip being disposed in opposition to the first chip so as to oppose the second pads and the second joining region respectively to the first pads and the first joining region; electrical connection parts which electrically connect the first pads to the second pads, respectively; and joining parts provided between the first joining region and the second joining region opposed to the first joining region to join the first chip and the second chip to each other.

Claims

1. A semiconductor apparatus comprising:

a first chip including a MEMS device which has a structure supported in midair therein, and having first pads and a first joining region electrically connected to the MEMS device on a top face thereof;

a second chip including a circuit having a semiconductor device electrically connected to the MEMS device therein, and having second pads and a second joining region electrically connected to the semiconductor device on a top face thereof, the second chip being disposed in opposition to the first chip so as to oppose the second pads and the second joining region respectively to the first pads and the first joining region;

electrical connection parts which electrically connect the first pads to the second pads, respectively; and

joining parts provided between the first joining region and the second joining region opposed to the first joining region to join the first chip and the second chip to each other.

2. The apparatus according to claim 1, wherein

the first joining region surrounds the MEMS device and the first pads, and

the second joining region surrounds the semiconductor device and the second pads.

3. The apparatus according to claim 2, wherein

the first pads are located between the MEMS device and the first joining region, and

the second pads are located between the semiconductor device and the second joining region.

4. The apparatus according to claim 1, wherein

the joining parts are formed of a sealing material, and

the MEMS device is sealed by using the joining parts.

5. The apparatus according to claim 4, wherein

the MEMS device comprises at least one vibration type angular velocity sensor, and

the vibration type angular velocity sensor is subjected to vacuum sealing.

6. The apparatus according to claim 5, wherein the semiconductor device comprises a detection circuit which detects an angular velocity on the basis of an output signal of the vibration type angular velocity sensor.