Semiconductor device comprising an image sensor, apparatus comprising such a semiconductor device and method of manufacturing such a semiconductor device

• US 20090127644A1
• Filed: 11/16/2007
• Published: 05/21/2009
• Est. Priority Date: 11/16/2007
• Status: Abandoned Application

• Current Assignee: Dalsa Corporation (Teledyne Technologies Incorporated)
• Original Assignee: Anton Petrus M. Van Arendonk, Brian Wayne Benwell, Vic Pantea
• Inventors: Pantea, Vic, Benwell, Brian Wayne, Van Arendonk, Anton Petrus Maria
• Application Number:
  US11/985,788
• Publication Number:
  US 20090127644A1
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

The invention relates to a semiconductor device comprising a semiconductor body in which an image sensor is formed and having a semiconductor body surface with an optically active part of the image sensor and a non-optically active part of the image sensor in which electrical connection areas of the image sensor are located, a spacer structure being present on the semiconductor body surface in the non-optically active part of the image sensor and an optical passive component being positioned on top of the spacer structure and above the image sensor and allowing radiation to impinge on the optically active part of the image sensor.

According to the invention the spacer structure is an open structure allowing the atmosphere above the optically active part of the image sensor to contact the atmosphere outside the spacer structure. The spacer structure may comprise a ring provided with at least one interruption and positioned around the optically active part of the image sensor. Preferably, the spacer structure comprises a plurality of dots.

Claims

1. A semiconductor device comprising a semiconductor body in which an image sensor is formed and having a semiconductor body surface with an optically active part of the image sensor and a non-optically active part of the image sensor in which electrical connection areas of the image sensor are located, a spacer structure being present on the semiconductor body surface in the non-optically active part of the image sensor and an optical passive component being positioned on top of the spacer structure and above the image sensor and allowing radiation to impinge on the optically active part of the image sensor, characterized in that the spacer structure is an open structure allowing the atmosphere above the optically active part of the image sensor to contact the atmosphere outside the spacer structure.

2. A semiconductor device as claimed in claim 1, characterized in that the spacer structure comprises an annular structure around the optically active part of the image sensor having at least one interruption.

3. A semiconductor device as claimed in claim 1, characterized in that the spacer structure comprises a plurality of dots positioned at regular distances from each other around the optically active part of the image sensor.

4. A semiconductor device as claimed in claim 3, characterized in that the number of dots lies between 10 and 500.

5. A semiconductor device as claimed in claim 1, characterized in that the semiconductor body with the image sensor is positioned on and fixed to a carrier comprising further electrical connection areas that are electrically connected to the electrical connection areas of the image sensor.

6. A semiconductor device as claimed in claim 5, characterized in that a further semiconductor body comprising a further image sensor is positioned on and fixed to the carrier next to the semiconductor body with the image sensor while the spacer structure and the optically passive component extend above both the image sensor and the further image sensor.

7. A semiconductor device as claimed in claim 1, characterized in that the spacer structure is formed of an organic material preferably a polymer.

8. A semiconductor device as claimed in claim 1, characterized in that the spacer structure is formed by micro jetting.

9. A semiconductor device as claimed in claim 1, characterized in that the spacer structure has a stress-releasing function in order to avoid damage of change of electrical properties in the non-optically active part of the image sensor.

10. An apparatus comprising a semiconductor device as claimed in claim 1.

11. A method of manufacturing a semiconductor device comprising a semiconductor body in which an image sensor is formed and having a semiconductor body surface with an optically active part of the image sensor and a non-optically active part of the image sensor in which electrical connection areas of the image sensor are located, a spacer structure being formed on the semiconductor body surface in the non-optically active part of the image sensor and an optical passive component is positioned on top of the spacer structure and above the image sensor and allowing radiation to impinge on the optically active part of the image sensor, characterized in that the spacer structure is formed as an open structure allowing the atmosphere above the optically active part of the image sensor to contact the atmosphere outside the spacer structure.

12. A method as claimed in claim 11, characterized in that the spacer structure is formed as an annular structure around the optically active part of the image sensor which is provided with at least one interruption.

13. A method as claimed in claim 11, characterized in that the spacer structure is formed as a plurality of dots that are positioned at regular distances from each other around the optically active part of the image sensor.

14. A method as claimed in claim 13, characterized in that the spacer structure is formed by micro jetting