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Stacking die package structure for semiconductor devices and method of the same

  • US 20090127686A1
  • Filed: 11/21/2007
  • Published: 05/21/2009
  • Est. Priority Date: 11/21/2007
  • Status: Abandoned Application
First Claim
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1. A first multi-die package structure for semiconductor devices, comprising:

  • a substrate having die receiving window and inter-connecting through holes formed therein;

    a first level semiconductor die formed under a second level semiconductor die by back-to-back scheme and within said die receiving window, wherein said first multi-die package includes first level contact pads formed under said first level semiconductor die having a first level build up layer formed there-under to couple to a first bonding pads of said first level semiconductor die;

    a second level contact pads formed on said second level semiconductor die having a second level build up layer formed thereon to couple to second bonding pads of said second level semiconductor die; and

    conductive bumps formed under said first level build up layer for coupling to said first level contact pads.

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