Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program

• US 20090128171A1
• Filed: 03/30/2006
• Published: 05/21/2009
• Est. Priority Date: 03/31/2005
• Status: Abandoned Application

• Current Assignee: OCTEC, Inc., Tokyo Electron Limited
• Original Assignee: OCTEC, Inc., Tokyo Electron Limited
• Inventors: Yakabe, Masami, Okumura, Katsuya, Ikeuchi, Naoki
• Application Number:
  US11/887,476
• Publication Number:
  US 20090128171A1
• Time in Patent Office: Days
• US Class Current: 324/754.70
• CPC Class Codes: B81C 99/005 Test apparatus
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: G01P 21/00 Testing or calibrating of apparatus or devices covered by the preceding groups

Abstract

An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided.

When inspection on a microstructure is performed, first a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other. Subsequently, the pair of probes (2) are switched to a measuring unit (40) side from the fritting power source (50) through the relays (30), and electrically connected to the measuring unit (40).

Claims

1. A microstructure probe card for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, comprising:

two probes for one inspection electrode to cause said inspection electrode provided on said microstructure and a probe provided on said probe card to conduct each other by employing fritting phenomenon.

2. The microstructure probe card according to claim 1, further comprising conduction means for causing said inspection electrode and said probe to conduct each other by employing fritting phenomenon.

3. The microstructure probe card according to claim 1, further comprising fluctuating means for causing said movable portion of said microstructure to fluctuate to inspect a characteristic of said microstructure.

4. The microstructure probe card according to claim 3, wherein said fluctuating means includes at least one sound-wave generation means for outputting a test sound wave with respect to said movable portion of said microstructure.

5. The microstructure probe card according to claim 1, wherein a leading end of said probe which are supposed to contact said inspection electrode of said microstructure contacts said inspection electrode of said microstructure perpendicularly.

6. A microstructure inspecting device for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, comprising:

means for causing a probe to contact an inspection electrode of said microstructure; and

conduction means for causing said inspection electrode and said probe to conduct each other by employing fritting phenomenon.

7. The microstructure inspecting device according to claim 6, wherein said conduction means includes:

a fritting power source used for applying a voltage to said inspection electrode to cause said fritting phenomenon;

a measuring unit which is electrically connected to said inspection electrode and outputs an inspection signal for executing a predetermined inspection; and

a switching circuit which is connected to said fritting power source when said fritting phenomenon is caused, and connected to said measuring unit when said predetermined inspection is executed.

8. The microstructure inspecting device according to claim 6, wherein said conduction means includes:

voltage output means for applying a voltage signal which causes fritting phenomenon to said inspection electrode or applying an inspection voltage signal for executing a predetermined inspection to said inspection electrode; and

detection means for detecting a signal detected from said inspection electrode in response to said inspection voltage signal.

9. The microstructure inspecting device according to claim 6, further comprising at least one sound wave generation means for outputting a test sound wave with respect to said movable portion of said microstructure.

10. The microstructure inspecting device according to claim 6, wherein said microstructure corresponds to either one of an accelerometer and an inclined angle sensor.

11. The microstructure inspecting device according to claim 10, wherein said accelerometer and said inclined angle sensor correspond to a multi-axes accelerometer and a multi-axes inclined angle sensor, respectively.

12. A microstructure inspecting method for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, comprising:

a contact step of contacting a probe to an inspection electrode of said microstructure; and

a conduction step of causing said inspection electrode and said probe to conduct each other by employing fritting phenomenon.

13. The microstructure inspecting method according to claim 12, wherein

said conduction step includes a step of connecting said probe to a fritting power source to cause said fritting phenomenon, and applying a voltage to said inspection electrode, and

the method further comprises a step of outputting an inspection signal for executing a predetermined inspection to said inspection electrode after said inspection electrode and said probe are conducted each other.

14. The microstructure inspecting method according to claim 13, further comprising a step of detecting a signal detected from said inspection electrode in response to said inspection signal.

15. The microstructure inspecting method according to claim 12, wherein said contact step causes said probe to contact said inspection electrode of said microstructure perpendicularly.

16. The microstructure inspecting method according to claim 12, wherein said contact step further includes a contact detection step of detecting that said inspection electrode and said probe come in contact with each other.

17. The microstructure inspecting method according to claim 16, wherein said contact detection step is performed by detecting a change in an electrical resistance between said probes which contact one inspection electrode.

18. The microstructure inspecting method according to claim 16, wherein said contact step includes a displacement step of causing said probe to displace with respect to said inspection electrode by a predetermined displacement amount after said contact detection step.

19. The inspecting method according to claim 18, wherein in said displacement step, said predetermined displacement amount that said probe is displaced with respect to said inspection electrode is a same amount to all microstructures formed on said substrate.

20. The microstructure inspecting method according to claim 12, comprising a fluctuation step of causing said movable portion of said microstructure to fluctuate to inspect said characteristic of said microstructure.

21. The microstructure inspecting method according to claim 20, wherein said fluctuation step is performed after said conduction step.

22. A microstructure inspecting method for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, comprising:

a contact detection step of detecting that an inspection electrode of said microstructure and a probe come in contact with each other.

23. The microstructure inspecting method according to claim 22, comprising a displacement step of causing said probe to displace with respect to an inspection electrode by a predetermined displacement amount after said contact detection step.

24. The inspecting method according to claim 23, wherein in said displacement step, a predetermined movement amount that said probe is moved with respect to said inspection electrode is a same amount to all microstructures formed on said substrate.

25. A computer program for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, allowing a computer to function as:

contact means for causing an inspection electrode of said microstructure and a probe to contact each other; and

conduction means for causing said inspection electrode and said probe to conduct each other by employing fritting phenomenon.

26. A computer program for inspecting a characteristic of at least one microstructure formed on a substrate and having a movable portion, allowing a computer to function as:

microstructure inspecting means which includes contact detection means for detecting that an inspection electrode of said microstructure and a probe come in contact with each other.