Single-Layer Metallization and Via-Less Metamaterial Structures
First Claim
Patent Images
1. A metamaterial device comprising:
- a dielectric substrate having a first surface and a second, different surface; and
a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface.
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Abstract
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
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Citations
78 Claims
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1. A metamaterial device comprising:
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a dielectric substrate having a first surface and a second, different surface; and a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A metamaterial device, comprising:
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a dielectric substrate having a first surface and a second, different surface; a first metallization layer formed on the first surface; and a second metallization layer formed on the second surface, wherein the first and second metallization layers are patterned to have two or more conductive parts to form a composite left and right handed (CRLH) metamaterial structure that comprises a unit cell which is free of a conductive via penetrating the dielectric substrate to connect the first metallization layer and the second metallization layer. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66)
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67. A metamaterial device comprising:
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a dielectric substrate having a first surface and a second, different surface; a cell patch on the first surface; a top ground electrode spaced from the cell patch and located on the first surface; a top via line on the first surface having a first end connected to the cell patch and a second end connected to the top ground electrode; a cell launch pad formed on the second surface beneath the cell patch on the first surface and electromagnetically coupled to the cell patch through the substrate to direct a signal to or receive a signal from the cell patch without being directly connected to the cell patch through a conductive via that penetrates through the substrate; and a bottom feed line formed on the second surface and connected to the cell launch pad to direct the signal to or from cell launch pad, wherein the cell patch, the top ground electrode, the top via line, the cell launch pad, and the bottom feed line form a composite left and right handed (CRLH) metamaterial structure. - View Dependent Claims (68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78)
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Specification