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Single-Layer Metallization and Via-Less Metamaterial Structures

  • US 20090128446A1
  • Filed: 10/13/2008
  • Published: 05/21/2009
  • Est. Priority Date: 10/11/2007
  • Status: Active Grant
First Claim
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1. A metamaterial device comprising:

  • a dielectric substrate having a first surface and a second, different surface; and

    a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface.

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