Micro-chimney and thermosiphon die-level cooling
First Claim
1. A method for dissipating heat from a localized area within the semiconductor die, the method comprising:
- providing a semiconductor die constructed and arranged to have at least one conduit portion therein, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material, the heat-dissipating material comprises a fluid;
absorbing, by the conduit portion, heat from the localized area; and
dissipating, by the conduit portion, at least a portion of the heat away from the localized area.
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Accused Products
Abstract
A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
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Citations
6 Claims
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1. A method for dissipating heat from a localized area within the semiconductor die, the method comprising:
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providing a semiconductor die constructed and arranged to have at least one conduit portion therein, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material, the heat-dissipating material comprises a fluid; absorbing, by the conduit portion, heat from the localized area; and dissipating, by the conduit portion, at least a portion of the heat away from the localized area. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification