Light System and Method to Thermally Manage an LED Lighting System
First Claim
1. A light emitting diode (LED) light fixture comprising:
- a. a printed circuit board (PCB) having a first and second side;
b. at least one LED pad, said at least one LED pad mounted on either said PCB first or second side;
c. a plurality of LEDs mounted on said first side of said PCB in electrical communication with said at least one LED pad; and
d. at least one thermal via positioned adjacent at least one LED of said plurality, wherein said at least one thermal via allows a flow of air between said PCB first and second sides, wherein said at least one thermal via is coated with a plating, and wherein said plating is in conductive thermal communication with said at least one LED pad.
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Accused Products
Abstract
A method of cooling light emitting diode (LED) lighting systems and associated structures are disclosed and claimed herein. The method involves determining the areas of a printed circuit board (PCB) onto which LEDs will be mounted will have the highest temperature during operation and positioning thermal vias of a certain size in or adjacent that area. The thermal vias extend from the PCB first side through the PCB substrate to the PCB second side to allow fluid flow through the PCB. The thermal vias are coated with a plating so that thermal energy is conductively transferred from the area adjacent an LED or resistor to the thermal via. From the thermal via the thermal energy may be dissipated to the atmosphere adjacent the thermal via through various modes. Novel structures according to the present invention include LED circuits, light fixtures, PCBs, and various combinations thereof employing the thermal vias.
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Citations
21 Claims
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1. A light emitting diode (LED) light fixture comprising:
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a. a printed circuit board (PCB) having a first and second side; b. at least one LED pad, said at least one LED pad mounted on either said PCB first or second side; c. a plurality of LEDs mounted on said first side of said PCB in electrical communication with said at least one LED pad; and d. at least one thermal via positioned adjacent at least one LED of said plurality, wherein said at least one thermal via allows a flow of air between said PCB first and second sides, wherein said at least one thermal via is coated with a plating, and wherein said plating is in conductive thermal communication with said at least one LED pad.
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2. A light emitting diode (LED) light fixture comprising:
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a. a housing; b. a power supply mounted adjacent said housing, wherein said power supply is capable of connection to an electrical energy source; c. a printed circuit board (PCB) mounted within said housing having a first and a second side, wherein said PCB is configured to be connected to said power supply, wherein said PCB comprises; i. a PCB substrate; ii. at least one power conductive pathway affixed to said PCB substrate; iii. at least one ground conductive pathway affixed to said PCB substrate; iv. at least one LED pad affixed to said PCB substrate; v. at least one resistor pad affixed to said PCB substrate; vi. a plurality of electrical lead apertures extending from said PCB first side through said PCB substrate to said PCB second side, wherein said electrical lead apertures a coated with a plating; and vii. a plurality of thermal vias extending from said PCB first side through said PCB substrate to said PCB second side, wherein said thermal vias are coated with a plating; d. at least one resistor electrically connected to said at least one power conductive pathway and said at least one resistor pad through two electrical lead apertures of said plurality; e. at least one LED electrically connected to said at least one LED pad and said at least one resistor pad through two electrical lead apertures of said plurality; and f. at least one LED electrically connected to at least two adjacent LED pads through two electrical lead apertures of said plurality, wherein said plurality of thermal vias and said at least one LED are configured to dissipate heat through the PCB first side, PCB second side, and said plurality of thermal vias. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14)
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13. A light emitting diode (LED) circuit comprising:
a. a printed circuit board (PCB), wherein said PCB has a first and a second side, said PCB comprising; i. a PCB substrate; ii. at least one power conductive pathway positioned on either said PCB first or second side configured for electrical connection to a power supply; iii. at least one ground conductive pathway positioned on either said PCB first or second side configured for electrical connection to a power supply; iv. at least one resistor pad positioned on either said PCB first or second side; v. at least one LED pad positioned on either said PCB first or second side; vi. a plurality of electrical lead apertures, wherein said lead apertures extend from said PCB first side through said PCB substrate to said PCB second side; and vii. a plurality of thermal vias, wherein each said thermal via extends from said PCB first side through said PCB substrate to said PCB second side, wherein each said thermal via is positioned either in said at least one LED pad or said at least one resistor pad, wherein each said thermal via is coated with a plating, and wherein each said thermal via is in thermal communication with either said at least one LED pad or said at least one resistor pad; b. at least one resistor, wherein said resistor electrically connects two lead apertures of said plurality of lead apertures; c. at least one LED, wherein said at least one LED electrically connects two electrical lead apertures of said plurality of electrical lead apertures, wherein said at least one power conductive pathway, at least one ground conductive pathway, at least one resistor pad, at least one LED pad, plurality of electrical lead apertures, at least one resistor, and at least one LED are configured so that a plurality of LEDs may be electrically connected in series. - View Dependent Claims (15, 17)
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16. A printed circuit board (PCB) for a light emitting diode (LED) light fixture, wherein said PCB has a first and second side, said printed circuit board comprising:
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a. a PCB substrate; b. at least one power conductive pathway positioned on at least said PCB first side, wherein said power conductive pathway is configured to be connected to an electrical energy source at a power connection; c. at least one ground conductive pathway positioned on at least said PCB first side, wherein said power conductive pathway is configured to be connected to an electrical energy source at a ground connection; d. a first and a second resistor pad, wherein said first resistor pad is positioned on said PCB first side, and wherein said second resistor pad is positioned on said PCB second side; e. a first and a second LED pad, wherein said first LED pad is positioned on said printed circuit board first side adjacent said first resistor pad, and wherein said second LED pad is positioned on said PCB first side adjacent said second resistor pad; f. a first, a second, a third, a fourth, a fifth, and a sixth electrical lead aperture, wherein said lead apertures extend from said PCB first side through said PCB substrate to said PCB second side, wherein said first electrical lead aperture is positioned in said power conductive pathway, wherein said second and third electrical lead apertures are positioned in said first and second resistor pads, wherein said fourth and fifth electrical lead apertures are positioned in said first and second LED pads, and wherein said sixth electrical lead aperture is positioned in said ground conductive pathway; g. at least one resistor, wherein said resistor electrically connects said first electrical lead aperture to said second electrical lead aperture; h. a first and a second LED, wherein said first and second LEDs have a first and a second LED lead, respectively, wherein said first LED lead of said first LED is positioned within said third electrical lead aperture, wherein said second LED lead of said first LED is positioned within said fourth electrical lead aperture, wherein said first LED lead of said second LED is positioned within said fifth electrical lead aperture, and wherein said second LED lead of said second LED is positioned within said sixth electrical lead aperture; and i. a plurality of thermal vias, wherein each said thermal via extends from said PCB first side through said PCB substrate to said PCB second side, wherein each said thermal via is positioned either in said first and second LED pads or said first and second resistor pads, and wherein each said thermal via is in thermal communication with either said first and second LED pads or said first and second resistor pads.
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18. A method of dissipating heat generated by a light emitting diode (LED) light fixture comprising:
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a. placing a plurality of LED pads on a printed circuit board (PCB), wherein said PCB is configured to be connected to a power supply; b. placing at least one resistor pad on said PCB; c. attaching at least one resistor to said at least one resistor pad and said power supply; d. attaching at least one LED to said at least one LED pad of said plurality and to said at least one resistor pad; e. attaching at least one LED to two adjacent LED pads of said plurality; and f. positioning at least one thermal via in at least one LED pad of said plurality adjacent said at least one LED such that said at least one thermal via is in thermal communication with said at least one LED pad of said plurality. - View Dependent Claims (19, 20, 21)
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Specification