Method of transformation of bridging organic groups in organosilica materials

• US 20090130412A1
• Filed: 09/22/2005
• Published: 05/21/2009
• Est. Priority Date: 09/22/2004
• Status: Abandoned Application

• Current Assignee: Benjamin David Hatton, Doug Dragan Perovic, Geoffrey Alan Ozin, Kai Manfred Martin Landskron
• Original Assignee: Benjamin David Hatton, Doug Dragan Perovic, Geoffrey Alan Ozin, Kai Manfred Martin Landskron
• Inventors: Hatton, Benjamin David, Landskron, Kai Manfred Martin, Perovic, Doug Dragan, Ozin, Geoffrey Alan
• Application Number:
  US11/921,325
• Publication Number:
  US 20090130412A1
• Time in Patent Office: Days
• US Class Current: 428/220
• CPC Class Codes: B01J 29/0308 Mesoporous materials not having base exchange properties, e.g. Si-MCM-41

Abstract

This invention relates to a chemical transformation of the bridging organic groups in metal oxide materials containing bridging organic groups, such as bridged organosilicas, wherein such a transformation greatly benefits properties for low dielectric constant (k) applications. A thermal treatment at specific temperatures is shown to cause a transformation of the organic groups from a bridging to a terminal configuration, which consumes polar hydroxyl groups. The transformation causes k to decrease, and the hydrophobicity to increase (through ‘self-hydrophobization’). As a result of the bridge-terminal transformation, porous organosilica films are shown to have k<2.0, E>6 GPa, do not require additional chemical surface treatment for dehydroxylation (hydrophobicity).

Claims

1. A method of treating a material comprising a metal oxide framework containing organic groups each bridging at least two metal atoms to increase a hydrophobicity and decrease a dielectric constant of said material, the method comprising the step of;

applying an effective treatment to cause a hydroxyl group-consuming chemical transformation of at least some of said organic groups from a bridging to a terminal configuration, wherein applying said effective treatment increases a hydrophobicity of said material and decreases a dielectric constant of said material.

2. The method according to claim 1 wherein said material comprising a metal oxide framework containing organic groups each bridging at least two metal atoms includes bridged organosilicas.

3. The method according to claim 2 wherein said bridged organosilicas include periodic mesoporous organosilicas (PMOs).

4. The method according to claim 1 which is porous, having one of a mesoporous structure having pores with a mean pore diameter in the range from less than 1 to about 50 nm and a macroporous structure with a mean pore diameter of at least 50 nm.

5. The method according to claim 1 wherein said material is in a form which is one of a film, a powder, a monolith.

6. The method according to claim 1 wherein, wherein the step of applying an effective treatment includes heating to cause a hydroxyl group-consuming chemical transformation.

7. The method according to claim 6 wherein the step of heating includes heating to at least 200°

C. for an effective period of time to affect said chemical transformation.

8. The method according to claim 6 wherein the step of heating includes heating the material in an atmosphere selected from the group consisting of air, nitrogen, helium, neon, argon, krypton, xenon, carbon dioxide and oxygen.

9. The method according to claim 1, wherein the step of applying an effective treatment includes optical, electrical, chemical or thermal means, including but not limited to ultraviolet radiation and oxidizing plasmas.

10. The method according to claim 1 wherein said dielectric constant is lowered to a value in a range from about 1.1 to about 3.0.

48. The method according to claim 1 wherein said dielectric constant is lowered to a value in a range from about 1.6 to about 2.2.

49. The method of claim 1, wherein the organic group is selected from group consisting of an alkylene group, an alkenylene group, alkynylene, phenylene group, hydrocarbons containing a phenylene group, and organic groups derived from compounds having at least one carbon atom.

50. The method of, claim 1 wherein the metal atoms are selected from the group consisting of silicon, germanium, titanium, aluminum, indium, zirconium, tantalum, niobium, tin, hafnium, magnesium, molybdenum, cobalt, nickel, gallium, beryllium, yttrium, lanthanum, lead and vanadium.

11. A material comprising a metal oxide framework containing organic groups produced by a method comprising the steps of:

synthesizing a metal oxide framework containing organic groups bridging at least two metal atoms; and

applying an effective treatment to cause a hydroxyl group-consuming chemical transformation of at least some of said organic groups from bridging to a terminal configuration.

12. A material produced by the method of claim 11, wherein the step of applying an effective treatment includes heating to cause a hydroxyl group-consuming chemical transformation.

13. The material produced by the method of claim 12 wherein the step of heating includes heating to at least 200°

C. for an effective period of time to affect said chemical transformation.

14. The material produced by the method of claim 12 wherein the step of heating includes heating the material in an atmosphere selected from the group consisting of air, nitrogen, helium, neon, argon, krypton, xenon, carbon dioxide and oxygen.

15. A material produced by the method of claim 11, wherein the step of applying an effective treatment includes exposing the material to any one of ultraviolet radiation (UV) and an oxidizing plasma to cause a transformation of the organic groups from bridging to terminal.

16. A material produced by the method of claim 11, wherein the step of producing a metal oxide framework includes producing said metal oxide framework structured using an organic template.

17. A material produced by the method of claim 16 wherein the organic template is selected from the group consisting of labile organic groups, solvents, thermally decomposable polymers, small molecules, cationic surfactants, anionic surfactants, non-ionic surfactants, dendrimers, hyper branched polymers, block copolymers, polyoxyalkylene compounds, colloidal polymeric particles, and combinations thereof.

18. A material produced by the method of claim 11 which is formed as a film.

19. A material produced by the method of claim 11 which is formed as a powder.

20. A material produced by the method of claim 11 which is formed as a monolith.

21. A material produced by the method of claim 18 which has a dielectric constant in a range from about 1.1 to about 3.0,

22. The material produced by the method of claim 18, wherein the film is deposited by any one of spin-coating, dip-coating, printing, casting, silk-screen, ink-jet, evaporation and vapour deposition.

23. The material produced by the method of claim 18 wherein the film has a thickness of at least 10 nm.

24. The material produced by the method of claim 18, having a refractive index of at least 1.15.

25. The material produced by the method of claim 18 having a Youngs modulus of at least 3 GPa.

26. A material produced by the method of claim 11 wherein a hydrophobicity of the material is increased due to the chemical transformation.

27. A material produced by the method of claim 11 which is porous.

28. A material produced by the method of claim 27 which has a mesoporous structure having pores with a mean pore diameter in the range from less than 1 to about 50 nm.

29. A material produced by the method of claim 27 which has a macroporous structure with a mean pore diameter of at least 50 nm.

30. A material produced by the method of claim 27 having a periodic arrangement of pores and a mean pore spacing of at least 2 nm.

31. The material produced by the method of claim 27 which has a periodic unit cell symmetry selected from the group consisting of a 2-dimensional hexagonal structure, a 3-dimensional hexagonal structure, a cubic structure, and a lamellar or porous lamellar structure.

32. The material produced by the method of claim 27 having a non-periodic arrangement of pores.

33. The material produced by the method of claim 27 wherein a porous volume of the porous material is in a range from about 0 to about 90 vol %.

34. The material produced by the method of claim 27, having a film morphology which is a continuous layer or collection of particles aggregated into a layer.

35. The material produced by the method of claim 11, wherein the organic group is selected from group consisting of an alkylene group, an alkenylene group, alkynylene, phenylene group, hydrocarbons containing a phenylene group, and organic groups derived from compounds having at least one carbon atom.

36. The material produced by the method of claim 11, wherein the metal atoms are selected from the group consisting of silicon, germanium, titanium, aluminum, indium, zirconium, tantalum, niobium, tin, hafnium, magnesium, molybdenum, cobalt, nickel, gallium, beryllium, yttrium, lanthanum, lead and vanadium and mixed metals.

47. A material produced by the method of claim 18 wherein said dielectric constant is lowered to a value in a range from about 1.6 to about 2.2.

51. The material produced by the method of claim 11 which exhibits a hardness greater than 0.5 GPa.

37. A periodic porous organosilica material wherein no other terminal groups are present but terminal organic groups bound to the Si atom by a Si—

C bond.

38. The material according to claim 37 comprising a metal oxide framework containing uniformly distributed terminal organic groups.

39. The material according to claim 37 which has a hydrophobic resistance to moisture adsorption.

40. The material according to claim 37 which has a dielectric constant in a range from about 1.1 to about 3.0.

41. The material according to claim 37 which has a dielectric constant in a range from about 1.6 to about 2.2.

42. The material according to claim 37 which has a Youngs modulus of at least 3 GPa.

43. The material according to claim 37 which is formed as a film, powder or monolith.

44. The material according to claim 37 which is porous.

45. The material according to claim 44 which has a mesoporous structure having pores with a mean pore diameter in the range from less than 1 to about 50 nm.

46. The material according to claim 44 which has a macroporous structure with a mean pore diameter of at least 50 nm.

52. The material according to claim 37 which exhibits a hardness greater than 0.5 GPa.