CONFORMABLE PHYSIOLOGICAL SENSOR

• US 20090131770A1
• Filed: 11/10/2008
• Published: 05/21/2009
• Est. Priority Date: 11/09/2007
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Covidien LP (Medtronic Plc)
• Inventors: SCHEUING, RICK, Gonopolskiy, Oleg, Anderson, Arik
• Granted Patent: US 9,636,057 B2
• Time in Patent Office: Days
• US Class Current: 600/310
• CPC Class Codes: A61B 2562/0233 Special features of optical sensors or probes classified in A61B5/00
• CPC Class Codes: A61B 2562/043 in a linear array
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/6833 Adhesive patches

Abstract

A sensor for measuring physiological characteristics includes a circuit assembly, at least one material layer, and an adhesive layer that extends beyond an outer edge of the circuit assembly. The at least one material layer forms an adhesive edge around the perimeter of the sensor.

Claims

1. A sensor for measuring physiological characteristics, comprising:

a circuit assembly;

at least one material layer; and

an adhesive layer that extends beyond an outer edge of the circuit assembly and the at least one material layer forming an adhesive edge around the perimeter of the sensor.

2. The sensor of claim 1, wherein the perimeter dimensions of the circuit assembly and the at least one material layer are smaller than the perimeter dimensions of the adhesive layer.

3. The sensor of claim 1, wherein the circuit assembly is disposed between a first tape layer and a second tape layer.

4. The sensor of claim 1, wherein the sensor is configured to conform to and maintain a shape of a surface.

5. The sensor of claim 1, wherein the circuit assembly includes a plurality of optical components, wherein a center of the optical components are axially aligned to a horizontal plane of the circuit assembly.

6. The sensor of claim 1, wherein the circuit assembly is disposed between a first material layer and a second material layer such that the first material layer and the second material layer collectively equal the thickness of the plurality of optical components to minimize pressure points.

7. A sensor, comprising:

a sensor pad assembly; and

an adhesive layer that extends beyond an outer edge of the sensor pad assembly, the sensor pad assembly and the adhesive layer being collectively configured to conform and maintain a shape of a surface on which the sensor is applied.

8. The sensor of claim 7, wherein said surface has a small radius compound curvature.

9. The sensor of claim 7, wherein the sensor pad assembly includes a circuit assembly and at least one material layer.

10. The sensor of claim 9, wherein the circuit assembly is disposed between a first material layer and a second material layer.

11. The sensor of claim 9, wherein the circuit assembly includes a plurality of optical components, each having a center axially aligned to a horizontal plane of the circuit assembly.

12. The sensor of claim 9, wherein the circuit assembly is disposed between a first material layer and a second material layer such that the first material layer and the second material layer collectively equal the thickness of the plurality of optical components to minimize pressure points.

13. The sensor of claim 11, wherein the optical components include at least one light source configured to emit multiple wavelengths and at least one detector.

14. The sensor of claim 9, wherein the circuit assembly includes a flexcircuit configured to have a particular shape and sufficient metallization to conform and maintain a shape of a surface on which the sensor is applied.