SOLID METAL BLOCK SEMICONDUCTOR LIGHT EMITTING DEVICE MOUNTING SUBSTRATES AND PACKAGES

• US 20090134421A1
• Filed: 01/30/2009
• Published: 05/28/2009
• Est. Priority Date: 10/25/2004
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H.
• Granted Patent: US 8,598,606 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

an insulating layer on the first metal face;

a conductive layer on the insulating layer that is patterned to provide first and second conductive traces that are configured to connect to at least one semiconductor light emitting device that is mounted on the first metal face; and

the second metal face including therein a plurality of metal heat sink fins.

2. A mounting substrate according to claim 1 wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.

3. A mounting substrate according to claim 1 wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.

4. A mounting substrate according to claim 1 wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

5. A mounting substrate according to claim 1 in combination with at least one semiconductor light emitting device that is mounted on the first metal face and electrically connected to the first and second conductive traces.

6. A mounting substrate according to claim 5 in further combination with a flexible film that includes an optical element therein on the first metal face, wherein the at least one semiconductor light emitting device is between the optical element and the first metal face.

7. A mounting substrate according to claim 6 wherein the optical element comprises a lens.

8. A mounting substrate according to claim 7 in further combination with a coating comprising phosphor on the lens.

9. A mounting substrate according to claim 7 wherein the lens includes phosphor dispersed therein.

10. A mounting substrate according to claim 1 further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second conductive traces.

11. A mounting substrate according to claim 1 further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second conductive traces.

12. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

an insulating layer on the first metal face;

a conductive layer on the insulating layer that is patterned to provide first and second conductive traces on the first metal face;

at least one semiconductor light emitting device that is mounted on the first metal face and electrically connected to the first and second conductive traces; and

a flexible film that includes an optical element therein on the first metal face, wherein the at least one semiconductor light emitting device is between the optical element and the first metal face.

13. A mounting substrate according to claim 12 wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.

14. A mounting substrate according to claim 12 wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.

15. A mounting substrate according to claim 12 wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

16. A mounting substrate according to claim 12 wherein the optical element comprises a lens.

17. A mounting substrate according to claim 16 in further combination with a coating comprising phosphor on the lens.

18. A mounting substrate according to claim 16 wherein the lens includes phosphor dispersed therein.

19. A mounting substrate according to claim 16 wherein the second metal face includes therein a plurality of metal heat sink fins.

20. A mounting substrate according to claim 12 further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second conductive traces.