LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
First Claim
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1. A light emitting diode (LED) package module, comprising:
- a substrate;
a first LED die disposed on the substrate by wire bonding or flip-chip bonding;
a second LED die disposed on the substrate by wire bonding or flip-chip bonding;
a connecting circuit, wherein the first LED die and the second LED die are electrically connected in series through the connecting circuit; and
a repairing circuit having two first extension portions, wherein the first extension portions are electrically connected with two electrodes of the first LED die, respectively.
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Abstract
A light emitting diode (LED) package module includes a substrate, a first LED die, a second LED die, a connecting circuit and a repairing circuit. The first LED die and the second LED die are disposed on the substrate by wire bonding or flip-chip bonding. The second LED die and the first LED die are electrically connected in series through the connecting circuit. The repairing circuit has two first extension portions, which are electrically connected with two electrodes of the first LED die, respectively. A manufacturing method of the LED package module is also disclosed.
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Citations
16 Claims
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1. A light emitting diode (LED) package module, comprising:
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a substrate; a first LED die disposed on the substrate by wire bonding or flip-chip bonding; a second LED die disposed on the substrate by wire bonding or flip-chip bonding; a connecting circuit, wherein the first LED die and the second LED die are electrically connected in series through the connecting circuit; and a repairing circuit having two first extension portions, wherein the first extension portions are electrically connected with two electrodes of the first LED die, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A manufacturing method of a LED package module, comprising steps of:
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forming a connecting circuit on a substrate; forming a repairing circuit on the substrate, wherein the repairing circuit has two first extension portions; and disposing a first LED die and a second LED die on the substrate by wire bonding or flip-chip bonding, wherein the first LED die and the second LED die are electrically connected in series, and the first extension portions are electrically connected with two electrodes of the first LED die, respectively. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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Specification