LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

• US 20090134422A1
• Filed: 11/19/2008
• Published: 05/28/2009
• Est. Priority Date: 11/23/2007
• Status: Abandoned Application

• Current Assignee: Gigno Technology Co., Ltd.
• Original Assignee: Gigno Technology Co., Ltd.
• Inventors: SAH, Wen-Jyh
• Application Number:
  US12/274,223
• Publication Number:
  US 20090134422A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode (LED) package module includes a substrate, a first LED die, a second LED die, a connecting circuit and a repairing circuit. The first LED die and the second LED die are disposed on the substrate by wire bonding or flip-chip bonding. The second LED die and the first LED die are electrically connected in series through the connecting circuit. The repairing circuit has two first extension portions, which are electrically connected with two electrodes of the first LED die, respectively. A manufacturing method of the LED package module is also disclosed.

Claims

1. A light emitting diode (LED) package module, comprising:

a substrate;

a first LED die disposed on the substrate by wire bonding or flip-chip bonding;

a second LED die disposed on the substrate by wire bonding or flip-chip bonding;

a connecting circuit, wherein the first LED die and the second LED die are electrically connected in series through the connecting circuit; and

a repairing circuit having two first extension portions, wherein the first extension portions are electrically connected with two electrodes of the first LED die, respectively.

2. The LED package module according to claim 1, further comprising:

a package body covering the first LED die and the second LED die, wherein the repairing circuit is partially exposed from the package body.

3. The LED package module according to claim 1, wherein the repairing circuit further has two first repairing pads, and each of the two first repairing pads is disposed on one end of each of the first extension portions away from the first LED die.

4. The LED package module according to claim 3, wherein the first extension portions are electrically connected with the electrodes of the first LED die through the connecting circuit.

5. The LED package module according to claim 3, wherein the repairing circuit further has two extension portions electrically connected with two electrodes of the second LED die, respectively.

6. The LED package module according to claim 5, wherein one of the second extension portions and one of the first extension portions are combined together.

7. The LED package module according to claim 5, wherein the repairing circuit further has two second repairing pads, and each of the second repairing pads is disposed on one end of each of the second extension portions away from the second LED die.

8. A manufacturing method of a LED package module, comprising steps of:

forming a connecting circuit on a substrate;

forming a repairing circuit on the substrate, wherein the repairing circuit has two first extension portions; and

disposing a first LED die and a second LED die on the substrate by wire bonding or flip-chip bonding, wherein the first LED die and the second LED die are electrically connected in series, and the first extension portions are electrically connected with two electrodes of the first LED die, respectively.

9. The manufacturing method according to claim 8, further comprising a step of:

disposing a package body to cover the first LED die and the second LED die, wherein the repairing circuit is partially exposed from the package body.

10. The manufacturing method according to claim 8, further comprising a step of

shorting the first extension portions when detecting that the first LED die is damaged.

11. The manufacturing method according to claim 10, wherein the step of shorting the first extension portions is performed by soldering, wiring, connecting with a low-resistance element, or laser welding through a vertical overlap area of the repairing circuit.

12. The manufacturing method according to claim 8, wherein the repairing circuit further has two first repairing pads, and each of the two first repairing pads is disposed on one end of each of the first extension portions away from the first LED die.

13. The manufacturing method according to claim 8, wherein the first extension portions are electrically connected with the electrodes of the first LED die through the connecting circuit.

14. The manufacturing method according to claim 8, wherein the repairing circuit further has two extension portions electrically connected with two electrodes of the second LED die, respectively.

15. The manufacturing method according to claim 14, wherein one of the second extension portions and one of the first extension portions are combined together.

16. The manufacturing method according to claim 14, wherein the repairing circuit further has two second repairing pads, and each of the second repairing pads is disposed on one end of each of the second extension portions away from the second LED die.