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LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

  • US 20090134422A1
  • Filed: 11/19/2008
  • Published: 05/28/2009
  • Est. Priority Date: 11/23/2007
  • Status: Abandoned Application
First Claim
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1. A light emitting diode (LED) package module, comprising:

  • a substrate;

    a first LED die disposed on the substrate by wire bonding or flip-chip bonding;

    a second LED die disposed on the substrate by wire bonding or flip-chip bonding;

    a connecting circuit, wherein the first LED die and the second LED die are electrically connected in series through the connecting circuit; and

    a repairing circuit having two first extension portions, wherein the first extension portions are electrically connected with two electrodes of the first LED die, respectively.

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