LIGHT EMITTING DIODE DEVICE

• US 20090134423A1
• Filed: 11/21/2008
• Published: 05/28/2009
• Est. Priority Date: 11/23/2007
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Hsu, Chih-Hung, Chen, Shang-Lin
• Granted Patent: US 8,994,046 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.

Claims

1. A light emitting diode (LED) device comprising:

a first lead frame

a LED die, fixed on and electrically connected to the first lead frame;

a second lead frame separated from the first lead frame with a distance and connected to the LED die; and

at least one bump, disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.

2. The LED device of claim 1, wherein the LED device is a LED chip, an ultra high efficiency LED chip or a laser diode chip.

3. The LED device of claim 1, wherein the LED die is fixed on a cup recess of the first lead frame.

4. The LED device of claim 3, wherein the LED die is electrically connected to the first lead frame by a first bonding wire.

5. The LED device of claim 3, wherein the LED die is fixed on and electrically connected to the first lead frame by a conductive silver paste.

6. The LED device of claim 3, wherein the LED die is electrically connected to the first lead frame by a second bonding wire.

7. The LED device of claim 1, wherein the gripping space is identified by the first lead frame the second lead frame and tow rectangular bumps;

and the gripping space is shaped as a rectangular recess parallel to the first lead frame and the second lead frame.

8. The LED device of claim 1, wherein the gripping space is identified by the first lead frame, the second lead frame and one single rectangular bump;

and the gripping space is shaped as a rectangular recess parallel to the first lead frame and the second lead frame.

9. The LED device of claim 1, wherein the gripping space is identified by the first lead frame the second lead frame and two arc bumps;

and the gripping space is shaped as a semi-cylinder parallel to the first lead frame and the second lead frame.

10. The LED device of claim 1, wherein the gripping space is identified by the first lead frame, the second lead frame and one single arc bump;

and the gripping space is shaped as a rectangular recess parallel to the first lead frame and the second lead frame.

11. The LED device of claim 1, wherein the bumps is bended inward to the gripping space for clamping the electronic element.

12. The LED device of claim 1, wherein the electronic element is a conductive wire.

13. The LED device of claim 1, wherein the electronic element is a conductive wire comprising a wire portion and a metal plate portion electrically connected to the wire portion.

14. The LED device of claim 13, wherein the metal plate portion has at least one through hole corresponding to the bump, and the conductive wire is fixed to one of the first lead frame and the second lead frame by disposing the bump inside the through hole.

15. The LED device of claim 14, wherein the bumps is bended inward to the gripping space for clamping the metal plate portion.

16. The LED device of claim 14, wherein the bump is bended outward from the gripping space for clamping the metal plate portion.

17. The LED device of claim 1, wherein the bump has a width extending from the first lead frame or the second lead frame, the width substantially less than 1 mm.

18. The LED device of claim 1, wherein the bump is a protrusion extending from the first lead frame or the second lead frame.

19. The LED device of claim 1, wherein the bump pivots on the first lead frame or the second lead frame.