ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE
First Claim
1. An electronic assembly for an image sensor device, comprising:
- a package module, comprising,a device substrate comprising an array of optoelectronic devices and at least one grounding plug therein, wherein the grounding plug is insulated from the device substrate and the array of optoelectronic devices,a transparent substrate comprising a dam portion attached to the device substrate to form a cavity between the device and transparent substrates, anda micro-lens array disposed on the device substrate and within the cavity;
a lens set, mounted on the package module; and
a first conductive layer, electrically connected to the grounding plug, and covering the sidewalls of the lens set and the package module and the upper surface of the lens set, having an opening allowing light to reach the array of optoelectronic devices.
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Accused Products
Abstract
An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.
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Citations
16 Claims
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1. An electronic assembly for an image sensor device, comprising:
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a package module, comprising, a device substrate comprising an array of optoelectronic devices and at least one grounding plug therein, wherein the grounding plug is insulated from the device substrate and the array of optoelectronic devices, a transparent substrate comprising a dam portion attached to the device substrate to form a cavity between the device and transparent substrates, and a micro-lens array disposed on the device substrate and within the cavity; a lens set, mounted on the package module; and a first conductive layer, electrically connected to the grounding plug, and covering the sidewalls of the lens set and the package module and the upper surface of the lens set, having an opening allowing light to reach the array of optoelectronic devices. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic assembly for an image sensor device, comprising:
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a package module, comprising, a device substrate, having front and rear surfaces, and comprising an array of optoelectronic devices therein and at least one grounding pad disposed on the rear surface of the device substrate and extending to the sidewall of the device substrate, wherein the grounding pad is insulated from the device substrate and the array of optoelectronic devices; a transparent substrate, comprising a dam portion attached to the front surface of the device substrate to form a cavity between the device and transparent substrates, and a micro-lens array, disposed on the front surface of the device substrate and within the cavity; a lens set mounted on the package module; and a conductive layer, covering the sidewall and the upper surface of the lens set and extending to the sidewall of the device substrate to contact the grounding pad, having an opening allowing light to reach the array of optoelectronic devices. - View Dependent Claims (9, 10, 11, 12, 13)
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14. An electronic assembly for an image sensor device, comprising:
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a package module, comprising, a device substrate, comprising an array of optoelectronic devices therein, a transparent substrate, comprising a dam portion attached to the device substrate to form a cavity between the device and transparent substrates, and a micro-lens array disposed on the device substrate and within the cavity; a lens set mounted on the package module; and a permeability layer covering the sidewalls of the lens set and the package module and the upper surface of the lens set, having an opening allowing light to reach the array of optoelectronic devices. - View Dependent Claims (15, 16)
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Specification