ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE

• US 20090134483A1
• Filed: 11/23/2007
• Published: 05/28/2009
• Est. Priority Date: 11/23/2007
• Status: Active Grant

• Current Assignee: Visera Technologies Company Limited (Taiwan Semiconductor Manufacturing Company Limited), Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Visera Technologies Company Limited (Taiwan Semiconductor Manufacturing Company Limited)
• Inventors: Lin, Tzu-Han, Weng, Jui-Ping
• Granted Patent: US 7,829,966 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

Claims

1. An electronic assembly for an image sensor device, comprising:

a package module, comprising,

a device substrate comprising an array of optoelectronic devices and at least one grounding plug therein, wherein the grounding plug is insulated from the device substrate and the array of optoelectronic devices,

a transparent substrate comprising a dam portion attached to the device substrate to form a cavity between the device and transparent substrates, and

a micro-lens array disposed on the device substrate and within the cavity;

a lens set, mounted on the package module; and

a first conductive layer, electrically connected to the grounding plug, and covering the sidewalls of the lens set and the package module and the upper surface of the lens set, having an opening allowing light to reach the array of optoelectronic devices.

2. The electronic assembly as claimed in claim 1, further comprising an opaque layer covering the first conductive layer.

3. The electronic assembly as claimed in claim 1, further comprising a transparent conductive layer disposed on the upper surface of the lens set and covered by the first conductive layer.

4. The electronic assembly as claimed in claim 3, wherein the transparent conductive layer comprises indium tin oxide.

5. The electronic assembly as claimed in claim 1, further comprising a second conductive layer disposed between the transparent and device substrates and electrically connected between the first conductive layer and the grounding plug.

6. The electronic assembly as claimed in claim 5, wherein the first and second conductive layers comprise metal.

7. The electronic assembly as claimed in claim 1, wherein the device substrate further comprises:

an array of plugs, disposed in and insulated from the device substrate and electrically connected to the array of optoelectronic devices;

a ball grid array, correspondingly disposed on the array of plugs; and

at least one grounding ball, correspondingly disposed on the grounding plug.

8. An electronic assembly for an image sensor device, comprising:

a package module, comprising,

a device substrate, having front and rear surfaces, and comprising an array of optoelectronic devices therein and at least one grounding pad disposed on the rear surface of the device substrate and extending to the sidewall of the device substrate, wherein the grounding pad is insulated from the device substrate and the array of optoelectronic devices;

a transparent substrate, comprising a dam portion attached to the front surface of the device substrate to form a cavity between the device and transparent substrates, and

a micro-lens array, disposed on the front surface of the device substrate and within the cavity;

a lens set mounted on the package module; and

a conductive layer, covering the sidewall and the upper surface of the lens set and extending to the sidewall of the device substrate to contact the grounding pad, having an opening allowing light to reach the array of optoelectronic devices.

9. The electronic assembly as claimed in claim 8, further comprising an opaque layer covering the conductive layer.

10. The electronic assembly as claimed in claim 8, further comprising a transparent conductive layer disposed on the upper surface of the lens set and covered by the conductive layer.

11. The electronic assembly as claimed in claim 10, wherein the transparent conductive layer comprises indium tin oxide.

12. The electronic assembly as claimed in claim 8, wherein the device substrate further comprises:

an array of plugs, disposed in and insulated from the device substrate and electrically connected to the array of optoelectronic devices;

a ball grid array, correspondingly disposed on the array of plugs; and

at least one grounding ball, correspondingly disposed on the grounding pad.

13. The electronic assembly as claimed in claim 8, wherein the conductive layer comprises metal.

14. An electronic assembly for an image sensor device, comprising:

a package module, comprising,

a device substrate, comprising an array of optoelectronic devices therein,

a transparent substrate, comprising a dam portion attached to the device substrate to form a cavity between the device and transparent substrates, and

a micro-lens array disposed on the device substrate and within the cavity;

a lens set mounted on the package module; and

a permeability layer covering the sidewalls of the lens set and the package module and the upper surface of the lens set, having an opening allowing light to reach the array of optoelectronic devices.

15. The electronic assembly as claimed in claim 14, further comprising an opaque layer covering the permeability layer.

16. The electronic assembly as claimed in claim 14, wherein the device substrate further comprises:

an array of plugs, disposed in and insulated from the device substrate and electrically connected to the array of optoelectronic devices; and

a ball grid array, correspondingly disposed on the array of plugs.