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SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

  • US 20090134528A1
  • Filed: 10/17/2008
  • Published: 05/28/2009
  • Est. Priority Date: 11/28/2007
  • Status: Abandoned Application
First Claim
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1. A semiconductor package, comprising:

  • a plurality of semiconductor chips mounted on a carrier;

    a first insulating layer disposed on the semiconductor chips;

    a plurality of first via-holes disposed in the first insulating layer and exposing a portion of each of the semiconductor chips;

    a first conductive pattern disposed in the first via-holes and electrically connected to the semiconductor chips; and

    an external terminal electrically connected to the first conductive pattern.

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