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Metamaterial Structures with Multilayer Metallization and Via

  • US 20090135087A1
  • Filed: 11/13/2008
  • Published: 05/28/2009
  • Est. Priority Date: 11/13/2007
  • Status: Abandoned Application
First Claim
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1. A metamaterial device comprising:

  • a substrate;

    a plurality of metallization layers associated with the substrate and patterned to have a plurality of conductive parts; and

    a conductive via formed in the substrate to connect a conductive part in one metallization layer to a conductive part in another metallization layer,wherein the conductive parts and the conductive via form a composite right and left handed (CRLH) metamaterial structure.

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