AIRFLOW MODULE, DATA STORAGE DEVICE ENCLOSURE AND METHOD OF COOLING ELECTRONICS MODULE

• US 20090135558A1
• Filed: 11/19/2008
• Published: 05/28/2009
• Est. Priority Date: 11/26/2007
• Status: Active Grant

• Current Assignee: Xyratex Technology Limited (Seagate Technology Holdings Plc)
• Original Assignee: Xyratex Technology Limited (Seagate Technology Holdings Plc)
• Inventors: HUGHES, Robert W.
• Granted Patent: US 9,084,375 B2
• Time in Patent Office: Days
• US Class Current: 361/679.460
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face; and, an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening. The first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use. The airflow channel is free from components that generate substantial amounts of heat in their normal operation.

Claims

1. An airflow module for being received in a module bay of a data storage device enclosure, the airflow module comprising a body having:

a first face having a first opening therein;

a second face having a second opening therein, the first face being adjacent to the second face; and

,

an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening,

wherein the first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use;

and the airflow channel is free from components that generate substantial amounts of heat in their normal operation.

2. An airflow module according to claim 1, comprising at least one guide runner to allow the airflow module to be guided into and out of a received position in a said module bay of a data storage device enclosure.

3. An airflow module according to claim 1, comprising a handle for allowing the airflow module to be inserted into or removed from a said module bay, and/or for latching the airflow module into position in a said module bay.

4. An airflow module according to claim 1, wherein the body comprises a third face, wherein the third face is orthogonal to the first and second faces, and the third face is closed to the passage of air therethrough.

5. An airflow module according to claim 4, wherein the body comprises a fourth face, wherein the fourth face opposes the third face, and the fourth face is closed to the passage of air therethrough.

6. An airflow module according to claim 1, wherein the first opening is sized and positioned so as to be adjacent to and at least partially overlapping with a primary airflow vent of a canister according to the Storage Bridge Bay version 1.0 specification when the airflow module is positioned adjacent to and on top of a said canister, so as to permit airflow between the primary vent of the canister and the airflow channel of the airflow module.

7. An airflow module according to claim 1, wherein the second opening is sized and positioned so as to be adjacent to and at least partially overlapping with a secondary airflow vent of a canister according to the Storage Bridge Bay version 1.0 specification when the airflow module is positioned adjacent to and side-by-side with a said canister, so as to permit airflow between the secondary vent of the canister and the airflow channel of the airflow module.

8. An airflow module according to claim 1, wherein the body comprises a fifth face, wherein the fifth face is opposed to the second face, and the fifth face has a third opening therein, wherein said airflow channel extends between the first opening, the second opening and the third opening so as to allow the passage of air between the first opening, the second opening and the third opening.

9. An airflow module according to claim 1, wherein the body is cuboid.

10. An airflow module according to claim 1, wherein the body has a first dimension of about 205.5±

1 mm and a second dimension of about 34.5±

1 mm.

11. An airflow module according to claim 1, wherein the body has a dimension of between about 75 mm and about 300 mm.

12. An airflow module according to claim 1, wherein the body comprises a hollow box-like structure, said faces of the body being provided by walls of the box and said openings being provided by respective holes in the walls.

13. A data storage device enclosure and an airflow module, the data storage device enclosure comprising:

a first and a second module bay each for receiving a respective module, the module bays being positioned adjacent to each other,

wherein at least the first module bay has at least one airflow aperture in a face of the bay via which air can be drawn through the first module bay;

the airflow module being received in the first module bay and comprising a body having;

a first face having a first opening therein;

a second face having a second opening therein; and

,

an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening;

wherein the first opening is in fluid communication with the second module bay and the second opening is in fluid communication with the airflow aperture, such that in use air can be drawn in a path through the second module bay, through the airflow channel, and through the airflow aperture.

14. A data storage device enclosure and an airflow module according to claim 13, the data storage device enclosure comprising at least one power supply unit bay adjacent the first electronics module bay and in fluid communication with the airflow aperture, such that in use a power supply unit in the power supply bay may draw said air in said path.

15. A data storage device enclosure and an airflow module according to claim 13, wherein the first and the second module bays have substantially the same width and height.

16. A data storage device enclosure and an airflow module according to claim 13, wherein the first and the second module bays are each arranged and configured to be able to accept an electronics module.

17. A data storage device enclosure and an airflow module according to claim 13, wherein the second module bay has at least one airflow aperture in a face of the bay.

18. A data storage device enclosure and an airflow module according to claim 13, wherein at least one of the module bays is compliant with the Storage Bridge Bay 1.0 specification.

19. A method of cooling an electronics module that is received in a data storage device enclosure, the electronics module having at least one airflow vent via which cooling air may be drawn through the module, the method comprising:

positioning the electronics module in a first module bay of the enclosure;

positioning an airflow module in a second module bay of the enclosure, wherein the second module bay is adjacent the first module bay and has at least one airflow aperture via which air can be drawn through the second module bay, wherein the airflow module comprises a body having a first face having a first opening therein, a second face having a second opening therein, and an airflow channel between the first opening and the second opening, the airflow module being positioned such that the first opening is in fluid communication with the airflow vent of the module and the second opening is in fluid communication with the airflow aperture of the second module bay; and

,

drawing air through the electronics module via the airflow vent in the electronics module, the airflow channel in the airflow module, and the airflow aperture in the second module bay so as to cool the electronics module.