Illuminating Equipment Using High Power LED With High Efficiency of Heat Dissipation

• US 20090135604A1
• Filed: 03/31/2005
• Published: 05/28/2009
• Est. Priority Date: 03/31/2005
• Status: Active Grant

• Current Assignee: Enraytek Optoelectronics Co., Ltd
• Original Assignee: NeoBulb Technologies Inc
• Inventors: Chen, Jen-Shyan
• Granted Patent: US 7,726,844 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21L 4/045 Pocket lamps
• CPC Class Codes: F21S 8/02 of recess-mounted type, e.g. downlighters specially adapted for vehicle exteriors F21S41/00-F21S45/00
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto.

Claims

1. An illuminating equipment, comprising:

a housing thereon defining a head end;

a reflector, disposed in the housing and near the head end, the reflector having an aperture;

a packaged system, disposed in the housing, comprising;

a casing;

a heat-conducting device, disposed in the casing, having a flat portion, the heat-conducting device being a hollow chamber, therein placed a working fluid and disposed a capillary structure;

at least one heat-dissipating fin, disposed in the casing and mounted on the periphery of the heat-conducting device; and

a light-emitting apparatus, mounted on the flat portion of the heat-conducting device and disposed through the aperture to an optical center of the reflector, for emitting a light in a form of point light source, wherein a heat, generated during the operation of the light-emitting apparatus, is conducted by the flat portion to the at least one heat-dissipating fin, and then is dissipated by the at least one heat-dissipating fin; and

a power supply, electrically connected to the light-emitting apparatus, for providing the light-emitting apparatus with the power when emitting the light.

2. The illuminating equipment of claim 1, wherein the reflector reflects the light emitted by the light-emitting apparatus outside the housing.

3. The illuminating equipment of claim 1, wherein the housing and the casing thereon provide a plurality of ventilating holes through which hot air in the housing and the casing induced by the heat is exhausted outside, thus increasing the efficiency of heat dissipation during the operation of the light-emitting apparatus.

4. The illuminating equipment of claim 1, wherein each of the at least one heat-dissipating fin is disposed surrounding the periphery of the heat-conducting device.

5. The illuminating equipment of claim 4, wherein each of the at least one heat-dissipating fin is disk-like.

6. The illuminating equipment of claim 1, wherein each of the at least one heat-dissipating fin is irregularly shaped.

7. The illuminating equipment of claim 1, wherein the light-emitting apparatus comprises:

a substrate;

at least one semiconductor light-emitting apparatus, disposed on the substrate, for emitting the light; and

two electrodes, respectively disposed on the substrate and electrically connected to each of the at least one semiconductor light-emitting apparatus.

8. The illuminating equipment of claim 7, wherein the substrate is formed of a silicon material.

9. The illuminating equipment of claim 7, wherein the substrate is formed of a metal material.

10. The illuminating equipment of claim 7, wherein each of the at least one semiconductor light-emitting apparatus is a light-emitting diode.

11. The illuminating equipment of claim 7, wherein each of the at least one semiconductor light-emitting apparatus is a laser diode.

12. The illuminating equipment of claim 7, further comprising a circuit board, disposed in the housing and electrically connected to the light-emitting apparatus and the power supply, for controlling the at least one semiconductor light-emitting apparatus to emit the light.

13. The illuminating equipment of claim 12, wherein each of the at least one heat-dissipating fin has at least one formed-through hole through which at least one electric line is wired to the circuit board and the light-emitting apparatus.

14. The illuminating equipment of claim 12, further comprising a fan, disposed in the housing, for increasing the efficiency of heat dissipation of the heat induced during the operation of the light-emitting apparatus.

15. The illuminating equipment of claim 14, wherein the fan is electrically connected to the circuit board, and the circuit board controls the switching-on or switching-off of the fan by use of a controlling circuit.

16. The illuminating equipment of claim 15, wherein the controlling circuit functions detect a temperature at the surround of the light-emitting apparatus to control the switching-on or switching-off of the fan in accordance with the detected temperature.

17. The illuminating equipment of claim 1, wherein the power supply is a D.C. power source or an A.C. power source.

18. The illuminating equipment of claim 1, wherein the power supply is externally connected to the housing.

19. The illuminating equipment of claim 1, wherein the power supply is disposed in the housing.

20. The illuminating equipment of claim 1, wherein the housing comprises:

a shell, in which the packaged system is disposed; and

an embedding assembly, mounted on the shell, thereon having at least one resilient body, said illuminating equipment is capable of being embedded in an object by use of the at least one resilient body.

21. The illuminating equipment of claim 1, wherein the housing provides a handle on an upper edge thereof.

22. The illuminating equipment of claim 1, wherein the heat-conducting device is a heat pipe.

23. The illuminating equipment of claim 1, wherein the heat-conducting device is a heat column.