LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
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Abstract
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
20 Citations
19 Claims
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1-12. -12. (canceled)
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13. A fabrication method of a light emitting diode package comprising steps of:
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forming an insulating film and electrode patterns on the insulating film on a submount silicon substrate; mounting an LED on the electrode patterns by flip-chip bonding; placing a spacer having a through hole on the electrode patterns to dispose the LED in the through hole; and adhering a planar optical element to the upper surface of the spacer. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A fabrication method of light emitting diode packages comprising steps of:
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forming an insulating film and a plurality of electrode patterns in their order on a silicon substrate; mounting a plurality of LEDs on the electrode patterns by flip-chip bonding; placing a spacer having a plurality of through holes on the plurality of electrode patterns to dispose each of the plurality of LEDs in each of the through holes; adhering a planar optical element to the upper surface of the spacer; and dicing a resultant structure with the planar optical element adhered thereto into individual LED packages.
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Specification